Synthesis and characterization of new functional poly(urethane-imide) crosslinked networks

Mi Hee Park, Wonbong Jang, Seung Jin Yang, Yong-Gun Shul, Haksoo Han

Research output: Contribution to journalArticle

22 Citations (Scopus)

Abstract

To synthesize new functional poly(urethaneimide) crosslinked networks, soluble polyimide from 2,2′-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride, 4,4′-oxydianiline, and maleic anhydride and polyurethane prepolymer from polycaprolactone diol, tolylene 2,4-diisocyanate and hydroxyl ethyl acrylate were prepared. Poly-(urethane-imide) thin films were finally prepared by the reaction between maleimide end-capped soluble polyimide (PI) and acrylate end-capped polyurethane (PU). The effect of polyurethane content on dielectric constant, residual stress, morphology, thermal property, and mechanical property was studied by FTIR, prism coupler, Thin Film Stress Analyzer (TFSA), XRD, TGA, DMTA, and Nano-indentation. Dielectric constant of poly(urethane-imide) thin films (2.39-2.45) was lower than that of pure polyimide (2.46). Especially, poly(urethane-imide) thin films with 50% of PU showed lower dielectric constant than other poly(urethane imide) thin films did. Lower residual stress and slope in cooling curve were achieved in higher PU content. Compared to typical polyurethane, poly(urethane-imide) thin films exhibited better thermal stability due to the presence of the imide groups. The glass transition temperature, modulus, and hardness decreased with increase in the flexible PU content even though elongation and thermal expansion coefficient increased. Finally, poly(urethane-imide) thin films with low residual stress and dielectric constant, which are strongly affected by the morphological structure, chain mobility, and modulus, can be suggested to apply for electronic devices by variation of PU.

Original languageEnglish
Pages (from-to)113-123
Number of pages11
JournalJournal of Applied Polymer Science
Volume100
Issue number1
DOIs
Publication statusPublished - 2006 Apr 5

Fingerprint

Imides
Polyurethanes
Urethane
Thin films
Permittivity
Polyimides
Residual stresses
Maleic Anhydrides
Polycaprolactone
Maleic anhydride
Nanoindentation
Prisms
Hydroxyl Radical
Thermal expansion
Elongation
Thermodynamic stability
Thermodynamic properties
Hardness
Cooling
Mechanical properties

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Surfaces, Coatings and Films
  • Polymers and Plastics
  • Materials Chemistry

Cite this

@article{4eba8af193204592b42990f987a53684,
title = "Synthesis and characterization of new functional poly(urethane-imide) crosslinked networks",
abstract = "To synthesize new functional poly(urethaneimide) crosslinked networks, soluble polyimide from 2,2′-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride, 4,4′-oxydianiline, and maleic anhydride and polyurethane prepolymer from polycaprolactone diol, tolylene 2,4-diisocyanate and hydroxyl ethyl acrylate were prepared. Poly-(urethane-imide) thin films were finally prepared by the reaction between maleimide end-capped soluble polyimide (PI) and acrylate end-capped polyurethane (PU). The effect of polyurethane content on dielectric constant, residual stress, morphology, thermal property, and mechanical property was studied by FTIR, prism coupler, Thin Film Stress Analyzer (TFSA), XRD, TGA, DMTA, and Nano-indentation. Dielectric constant of poly(urethane-imide) thin films (2.39-2.45) was lower than that of pure polyimide (2.46). Especially, poly(urethane-imide) thin films with 50{\%} of PU showed lower dielectric constant than other poly(urethane imide) thin films did. Lower residual stress and slope in cooling curve were achieved in higher PU content. Compared to typical polyurethane, poly(urethane-imide) thin films exhibited better thermal stability due to the presence of the imide groups. The glass transition temperature, modulus, and hardness decreased with increase in the flexible PU content even though elongation and thermal expansion coefficient increased. Finally, poly(urethane-imide) thin films with low residual stress and dielectric constant, which are strongly affected by the morphological structure, chain mobility, and modulus, can be suggested to apply for electronic devices by variation of PU.",
author = "Park, {Mi Hee} and Wonbong Jang and Yang, {Seung Jin} and Yong-Gun Shul and Haksoo Han",
year = "2006",
month = "4",
day = "5",
doi = "10.1002/app.22678",
language = "English",
volume = "100",
pages = "113--123",
journal = "Journal of Applied Polymer Science",
issn = "0021-8995",
publisher = "John Wiley and Sons Inc.",
number = "1",

}

Synthesis and characterization of new functional poly(urethane-imide) crosslinked networks. / Park, Mi Hee; Jang, Wonbong; Yang, Seung Jin; Shul, Yong-Gun; Han, Haksoo.

In: Journal of Applied Polymer Science, Vol. 100, No. 1, 05.04.2006, p. 113-123.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Synthesis and characterization of new functional poly(urethane-imide) crosslinked networks

AU - Park, Mi Hee

AU - Jang, Wonbong

AU - Yang, Seung Jin

AU - Shul, Yong-Gun

AU - Han, Haksoo

PY - 2006/4/5

Y1 - 2006/4/5

N2 - To synthesize new functional poly(urethaneimide) crosslinked networks, soluble polyimide from 2,2′-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride, 4,4′-oxydianiline, and maleic anhydride and polyurethane prepolymer from polycaprolactone diol, tolylene 2,4-diisocyanate and hydroxyl ethyl acrylate were prepared. Poly-(urethane-imide) thin films were finally prepared by the reaction between maleimide end-capped soluble polyimide (PI) and acrylate end-capped polyurethane (PU). The effect of polyurethane content on dielectric constant, residual stress, morphology, thermal property, and mechanical property was studied by FTIR, prism coupler, Thin Film Stress Analyzer (TFSA), XRD, TGA, DMTA, and Nano-indentation. Dielectric constant of poly(urethane-imide) thin films (2.39-2.45) was lower than that of pure polyimide (2.46). Especially, poly(urethane-imide) thin films with 50% of PU showed lower dielectric constant than other poly(urethane imide) thin films did. Lower residual stress and slope in cooling curve were achieved in higher PU content. Compared to typical polyurethane, poly(urethane-imide) thin films exhibited better thermal stability due to the presence of the imide groups. The glass transition temperature, modulus, and hardness decreased with increase in the flexible PU content even though elongation and thermal expansion coefficient increased. Finally, poly(urethane-imide) thin films with low residual stress and dielectric constant, which are strongly affected by the morphological structure, chain mobility, and modulus, can be suggested to apply for electronic devices by variation of PU.

AB - To synthesize new functional poly(urethaneimide) crosslinked networks, soluble polyimide from 2,2′-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride, 4,4′-oxydianiline, and maleic anhydride and polyurethane prepolymer from polycaprolactone diol, tolylene 2,4-diisocyanate and hydroxyl ethyl acrylate were prepared. Poly-(urethane-imide) thin films were finally prepared by the reaction between maleimide end-capped soluble polyimide (PI) and acrylate end-capped polyurethane (PU). The effect of polyurethane content on dielectric constant, residual stress, morphology, thermal property, and mechanical property was studied by FTIR, prism coupler, Thin Film Stress Analyzer (TFSA), XRD, TGA, DMTA, and Nano-indentation. Dielectric constant of poly(urethane-imide) thin films (2.39-2.45) was lower than that of pure polyimide (2.46). Especially, poly(urethane-imide) thin films with 50% of PU showed lower dielectric constant than other poly(urethane imide) thin films did. Lower residual stress and slope in cooling curve were achieved in higher PU content. Compared to typical polyurethane, poly(urethane-imide) thin films exhibited better thermal stability due to the presence of the imide groups. The glass transition temperature, modulus, and hardness decreased with increase in the flexible PU content even though elongation and thermal expansion coefficient increased. Finally, poly(urethane-imide) thin films with low residual stress and dielectric constant, which are strongly affected by the morphological structure, chain mobility, and modulus, can be suggested to apply for electronic devices by variation of PU.

UR - http://www.scopus.com/inward/record.url?scp=33644928454&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33644928454&partnerID=8YFLogxK

U2 - 10.1002/app.22678

DO - 10.1002/app.22678

M3 - Article

AN - SCOPUS:33644928454

VL - 100

SP - 113

EP - 123

JO - Journal of Applied Polymer Science

JF - Journal of Applied Polymer Science

SN - 0021-8995

IS - 1

ER -