Synthesis of new flexible diamine for applications in transparent poly(amide-imide) thin films with low residual stress

Kwangin Kim, Juheon Lee, Sangrae Lee, Taewon Yoo, Haksoo Han

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

A method to improve the optical properties of transparent poly(amide-imide) (PAI) by incorporating a new flexible diamine is demonstrated. The new diamine-incorporated PAI films show a lower glass transition temperature, yellow index, residual stress than neat PAIs irrespective of their structure. The DSC results show that the new diamine increases the flexibility of the polymer matrix indicating the poor packing of the matrix. However, the light transmittance reduces from 89.73 to 88.58%. This discrepancy can be clarified by measuring the residual stress of the PAI films. The results confirm that PAI has high elasticity and flexibility at low and high temperatures. Thus, flexible diamines can be added to PAI films for transparent materials owing to their good optical properties such as a transmittance of over 87%, yellow index lower than 2.8 and low residual stress <20 MPa. Moreover, such diamines eliminate the occurrence of cracks in the substrate.

Original languageEnglish
Pages (from-to)130-140
Number of pages11
JournalProgress in Organic Coatings
Volume117
DOIs
Publication statusPublished - 2018 Apr 1

Fingerprint

Polyamideimides
Imides
Diamines
Amides
Residual stresses
Thin films
Optical properties
Polymer matrix
Elasticity
Cracks
Substrates

All Science Journal Classification (ASJC) codes

  • Chemical Engineering(all)
  • Surfaces, Coatings and Films
  • Organic Chemistry
  • Materials Chemistry

Cite this

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abstract = "A method to improve the optical properties of transparent poly(amide-imide) (PAI) by incorporating a new flexible diamine is demonstrated. The new diamine-incorporated PAI films show a lower glass transition temperature, yellow index, residual stress than neat PAIs irrespective of their structure. The DSC results show that the new diamine increases the flexibility of the polymer matrix indicating the poor packing of the matrix. However, the light transmittance reduces from 89.73 to 88.58{\%}. This discrepancy can be clarified by measuring the residual stress of the PAI films. The results confirm that PAI has high elasticity and flexibility at low and high temperatures. Thus, flexible diamines can be added to PAI films for transparent materials owing to their good optical properties such as a transmittance of over 87{\%}, yellow index lower than 2.8 and low residual stress <20 MPa. Moreover, such diamines eliminate the occurrence of cracks in the substrate.",
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Synthesis of new flexible diamine for applications in transparent poly(amide-imide) thin films with low residual stress. / Kim, Kwangin; Lee, Juheon; Lee, Sangrae; Yoo, Taewon; Han, Haksoo.

In: Progress in Organic Coatings, Vol. 117, 01.04.2018, p. 130-140.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Synthesis of new flexible diamine for applications in transparent poly(amide-imide) thin films with low residual stress

AU - Kim, Kwangin

AU - Lee, Juheon

AU - Lee, Sangrae

AU - Yoo, Taewon

AU - Han, Haksoo

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AB - A method to improve the optical properties of transparent poly(amide-imide) (PAI) by incorporating a new flexible diamine is demonstrated. The new diamine-incorporated PAI films show a lower glass transition temperature, yellow index, residual stress than neat PAIs irrespective of their structure. The DSC results show that the new diamine increases the flexibility of the polymer matrix indicating the poor packing of the matrix. However, the light transmittance reduces from 89.73 to 88.58%. This discrepancy can be clarified by measuring the residual stress of the PAI films. The results confirm that PAI has high elasticity and flexibility at low and high temperatures. Thus, flexible diamines can be added to PAI films for transparent materials owing to their good optical properties such as a transmittance of over 87%, yellow index lower than 2.8 and low residual stress <20 MPa. Moreover, such diamines eliminate the occurrence of cracks in the substrate.

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