Temperature characteristic of high-Tc coated conductor by numerical method when a fault current flows

Sukjin Choi; Young Jae Kim; Ki Sung Chang; Jae Young Jang; Sangjin Lee; Tae Kuk Ko

doi:10.1109/TASC.2010.2094172

Temperature characteristic of high-Tc coated conductor by numerical method when a fault current flows

Sukjin Choi, Young Jae Kim, Ki Sung Chang, Jae Young Jang, Sangjin Lee, Tae Kuk Ko

Department of Electrical and Electronic Engineering

Research output: Contribution to journal › Article › peer-review

2 Citations (Scopus)

Abstract

The superconducting fault current limiter (SFCL) is a protection device for an electric power system. In other to design the SFCL, the temperature of the HTS tapes should be calculated under the over-current caused by fault condition. The structure and property of HTS tape have an effect on the temperature. In this paper, finite element method is performed to estimate the temperature characteristic of HTS coated conductor (CC) under the over-current. Three kinds of CCs are modeled and analyzed with respect to the internal resistance. In order to prove the reliability of the simulation method, the results from the electrical and thermal analysis are compared with the experimental data. On the basis of results, the proposed results in this study can be utilized to design HTS CC for the SFCL.

Original language	English
Article number	5677561
Pages (from-to)	1233-1237
Number of pages	5
Journal	IEEE Transactions on Applied Superconductivity
Volume	21
Issue number	3 PART 2
DOIs	https://doi.org/10.1109/TASC.2010.2094172
Publication status	Published - 2011 Jun

Bibliographical note

Funding Information:
Manuscript received August 03, 2010; accepted November 15, 2010. Date of publication December 30, 2010; date of current version May 27, 2011. This work was supported by the Human Resources Development Program of the Korea Institute of Energy Technology Evaluation and Planning (KETEP) Grant funded by the Korea Government Ministry of Knowledge Economy (2007-P-EP-HM-E-08-0000). S. Choi, Y. J. Kim, K. S. Chang, J. Y. Jang, and T. K. Ko are with the Yonsei University (e-mail: tkko@yonsei.ac.kr). S. Lee is with the Uiduk University (e-mail:sjlee@uu.ac.kr). Color versions of one or more of the figures in this paper are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/TASC.2010.2094172

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering

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Cite this

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title = "Temperature characteristic of high-Tc coated conductor by numerical method when a fault current flows",

abstract = "The superconducting fault current limiter (SFCL) is a protection device for an electric power system. In other to design the SFCL, the temperature of the HTS tapes should be calculated under the over-current caused by fault condition. The structure and property of HTS tape have an effect on the temperature. In this paper, finite element method is performed to estimate the temperature characteristic of HTS coated conductor (CC) under the over-current. Three kinds of CCs are modeled and analyzed with respect to the internal resistance. In order to prove the reliability of the simulation method, the results from the electrical and thermal analysis are compared with the experimental data. On the basis of results, the proposed results in this study can be utilized to design HTS CC for the SFCL.",

author = "Sukjin Choi and Kim, {Young Jae} and Chang, {Ki Sung} and Jang, {Jae Young} and Sangjin Lee and Ko, {Tae Kuk}",

note = "Funding Information: Manuscript received August 03, 2010; accepted November 15, 2010. Date of publication December 30, 2010; date of current version May 27, 2011. This work was supported by the Human Resources Development Program of the Korea Institute of Energy Technology Evaluation and Planning (KETEP) Grant funded by the Korea Government Ministry of Knowledge Economy (2007-P-EP-HM-E-08-0000). S. Choi, Y. J. Kim, K. S. Chang, J. Y. Jang, and T. K. Ko are with the Yonsei University (e-mail: tkko@yonsei.ac.kr). S. Lee is with the Uiduk University (e-mail:sjlee@uu.ac.kr). Color versions of one or more of the figures in this paper are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/TASC.2010.2094172",

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