Temperature dependence of anti-adhesion between a stamper with sub-micron patterns and the polymer in nano-moulding processes

Namseok Lee, Young Kyu Kim, Shinill Kang

Research output: Contribution to journalArticle

14 Citations (Scopus)

Abstract

With increasing demand for micro/nano-polymeric components, micro-/nano-moulding using a nano-stamper has received much attention. When the features of the patterns on the stamper become smaller, the moulding temperature needs to be increased for improving the ability of the stamper to replicate quality polymeric components using nano-moulding. However, if the temperature is too high, the adhesion between the stamper and the polymer may deteriorate the surface quality of the moulded part, excessively wearing down the stamper surface. In this study, an experimental method is presented to analyse the temperature dependence of the anti-adhesion property between a stamper with sub-micron patterns and the polymer. For the analysis, the contact angle between the stamper and the polymer was measured at the temperature of the actual nano-moulding process, in which the stamper is heated above the glass transition temperature of the polymer. The effects of the moulding temperature and the contact angle on the surface quality and the replication quality of the moulded substrates were analysed experimentally.

Original languageEnglish
Pages (from-to)1624-1629
Number of pages6
JournalJournal of Physics D: Applied Physics
Volume37
Issue number12
DOIs
Publication statusPublished - 2004 Jun 21

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Acoustics and Ultrasonics
  • Surfaces, Coatings and Films

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