The benefits of atomic layer deposition in non-semiconductor applications; producing metallic nanomaterials and fabrication of flexible display

Hyungjun Kim, Woo Hee Kim, Han Bo Ram Lee, S. J. Lim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Atomic layer deposition (ALD) is a promising deposition technique for nanoscale device fabrication due to its great benefits including excellent conformality, atomic scale thickness control, high quality deposition at low growth temperature, and large area uniformity. In this presentation, we will present a couple of examples for novel applications of ALD; metallic nanomaterial fabrications combined by nanotemplate utilizing the excellent conformality of ALD and fabrication of driving devices for transparent flexible displays utilizing the ability of ALD to produce high quality materials at low growth temperature. These examples manifest the benefits of ALD in the near future industry.

Original languageEnglish
Title of host publicationECS Transactions - Atomic Layer Deposition Applications 5
PublisherElectrochemical Society Inc.
Pages101-111
Number of pages11
Edition4
ISBN (Print)9781566777414
DOIs
Publication statusPublished - 2009
Event5th Symposium on Atomic Layer Deposition - 216th Meeting of the Electrochemical Society - Vienna, Austria
Duration: 2009 Oct 52009 Oct 7

Publication series

NameECS Transactions
Number4
Volume25
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Other

Other5th Symposium on Atomic Layer Deposition - 216th Meeting of the Electrochemical Society
Country/TerritoryAustria
CityVienna
Period09/10/509/10/7

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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