Abstract
Recently, more advanced image quality and many techniques are needed in 3D computer graphics. Especially texture mapping support is the major issue in the design of high performance 3D graphics system. In this paper, a high-performance 3D graphics hardware is designed for texture mapping. The proposed system is composed of a single-chip rasterizer and frame buffer using a processor-memory integration method, which is adapted for processing high-performance 3D graphics. Also, the texture mapping unit is designed using the processor-memory integration technology to provide sufficient bandwidth. Therefore, the tremendous memory bandwidth and the long latency required for texture mapping can be reduced by this approach.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the 2nd IEEE Asia Pacific Conference on ASICs, AP-ASIC 2000 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 219-222 |
| Number of pages | 4 |
| ISBN (Electronic) | 0780364708, 9780780364707 |
| DOIs | |
| Publication status | Published - 2000 Jan 1 |
| Event | 2nd IEEE Asia Pacific Conference on ASICs, AP-ASIC 2000 - Cheju, Korea, Republic of Duration: 2000 Aug 28 → 2000 Aug 30 |
Publication series
| Name | Proceedings of the 2nd IEEE Asia Pacific Conference on ASICs, AP-ASIC 2000 |
|---|
Other
| Other | 2nd IEEE Asia Pacific Conference on ASICs, AP-ASIC 2000 |
|---|---|
| Country | Korea, Republic of |
| City | Cheju |
| Period | 00/8/28 → 00/8/30 |
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All Science Journal Classification (ASJC) codes
- Hardware and Architecture
- Electrical and Electronic Engineering
Cite this
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The design of the perspective texture mapping for 3D computer graphics in rasterizer merged frame buffer technology. / Lee, Seung Gi; Park, Woo Chan; Lee, Won Jong; Jung, Woo Nam; Han, Tack Don.
Proceedings of the 2nd IEEE Asia Pacific Conference on ASICs, AP-ASIC 2000. Institute of Electrical and Electronics Engineers Inc., 2000. p. 219-222 896948 (Proceedings of the 2nd IEEE Asia Pacific Conference on ASICs, AP-ASIC 2000).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - The design of the perspective texture mapping for 3D computer graphics in rasterizer merged frame buffer technology
AU - Lee, Seung Gi
AU - Park, Woo Chan
AU - Lee, Won Jong
AU - Jung, Woo Nam
AU - Han, Tack Don
PY - 2000/1/1
Y1 - 2000/1/1
N2 - Recently, more advanced image quality and many techniques are needed in 3D computer graphics. Especially texture mapping support is the major issue in the design of high performance 3D graphics system. In this paper, a high-performance 3D graphics hardware is designed for texture mapping. The proposed system is composed of a single-chip rasterizer and frame buffer using a processor-memory integration method, which is adapted for processing high-performance 3D graphics. Also, the texture mapping unit is designed using the processor-memory integration technology to provide sufficient bandwidth. Therefore, the tremendous memory bandwidth and the long latency required for texture mapping can be reduced by this approach.
AB - Recently, more advanced image quality and many techniques are needed in 3D computer graphics. Especially texture mapping support is the major issue in the design of high performance 3D graphics system. In this paper, a high-performance 3D graphics hardware is designed for texture mapping. The proposed system is composed of a single-chip rasterizer and frame buffer using a processor-memory integration method, which is adapted for processing high-performance 3D graphics. Also, the texture mapping unit is designed using the processor-memory integration technology to provide sufficient bandwidth. Therefore, the tremendous memory bandwidth and the long latency required for texture mapping can be reduced by this approach.
UR - http://www.scopus.com/inward/record.url?scp=85010228379&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85010228379&partnerID=8YFLogxK
U2 - 10.1109/APASIC.2000.896948
DO - 10.1109/APASIC.2000.896948
M3 - Conference contribution
AN - SCOPUS:85010228379
T3 - Proceedings of the 2nd IEEE Asia Pacific Conference on ASICs, AP-ASIC 2000
SP - 219
EP - 222
BT - Proceedings of the 2nd IEEE Asia Pacific Conference on ASICs, AP-ASIC 2000
PB - Institute of Electrical and Electronics Engineers Inc.
ER -