The effectiveness of a thin refractory metal layer inserted into a Ta film by ion-assisted deposition as a diffusion barrier between copper and silicon

Jong Hoon Kim, Sung Man Lee, Joon Seop Kwak, Hong Koo Baik, Hyuk Ju Ryu, Jung Ho Je

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

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Physics & Astronomy