The fracture resistance of bonded Au wires for interconnection

jin woo Park, Young Bok Yoon, Joon Gil Lee

Research output: Contribution to journalArticle

Abstract

This paper presents the effects of the local strength degradation due to recrystallization and grain growth and the large deformation induced in wire bonding process on the fracture resistance of the bonded Au wires for interconnection. The experimental and numerical results show that, for a wire to deform to the required shape without reduction in the fracture resistance, sufficient ductility is more important than the strength of the wire.

Original languageEnglish
Pages (from-to)106-109
Number of pages4
JournalIEEE Transactions on Components and Packaging Technologies
Volume32
Issue number1
DOIs
Publication statusPublished - 2009 Jan 19

Fingerprint

Fracture toughness
Wire
Grain growth
Ductility
Degradation

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

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The fracture resistance of bonded Au wires for interconnection. / Park, jin woo; Yoon, Young Bok; Lee, Joon Gil.

In: IEEE Transactions on Components and Packaging Technologies, Vol. 32, No. 1, 19.01.2009, p. 106-109.

Research output: Contribution to journalArticle

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