Abstract
This paper presents the effects of the local strength degradation due to recrystallization and grain growth and the large deformation induced in wire bonding process on the fracture resistance of the bonded Au wires for interconnection. The experimental and numerical results show that, for a wire to deform to the required shape without reduction in the fracture resistance, sufficient ductility is more important than the strength of the wire.
| Original language | English |
|---|---|
| Pages (from-to) | 106-109 |
| Number of pages | 4 |
| Journal | IEEE Transactions on Components and Packaging Technologies |
| Volume | 32 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 2009 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering