The mechanical reliability of transparent ZnO TFT transfer printed on the flexible substrate

W. J. Hwang, K. T. Eun, K. Y. Park, J. H. Ahn, S. H. Choa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this study, we investigated the bendablity and reliability of transparent ZnO TFTs. Transfer printing method was used to make flexible ZnO TFTs. The PET was used as the transparent and flexible plastic substrate which thickness was 188 μm. The bending test and fatigue test were performed to evaluate the mechanical reliability. After reliability tests, the failure mode of ZnO TFTs was analyzed and its results were also confirmed by stress/strain simulation analysis.

Original languageEnglish
Title of host publicationPhysics of Semiconductors - 30th International Conference on the Physics of Semiconductors, ICPS-30
Pages879-880
Number of pages2
DOIs
Publication statusPublished - 2011
Event30th International Conference on the Physics of Semiconductors, ICPS-30 - Seoul, Korea, Republic of
Duration: 2010 Jul 252010 Jul 30

Publication series

NameAIP Conference Proceedings
Volume1399
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Other

Other30th International Conference on the Physics of Semiconductors, ICPS-30
CountryKorea, Republic of
CitySeoul
Period10/7/2510/7/30

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy(all)

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