The thermal resistance of solder joints in high brightness light emitting diode (HB LED) packages

Young Bok Yoon, Jin Woo Park

Research output: Contribution to journalArticle

14 Citations (Scopus)

Abstract

We present a framework to calculate the thermal resistance of AuSn eutectic solder joint (R th, Au-Sn joint) in high brightness light emitting diode (HB LED) packages whose heat extraction capability controls the optical efficiency and reliability of HB LEDs. Using the transient thermal measurement combined with the structure function based analytical method and the finite element method, we find that the thermal conductivity (k) of the thin solder joint becomes significantly smaller than the AuSn alloy after joining; hence, R th, Au-Sn joint constitutes a large portion of the total R th of the package (R th PKG).

Original languageEnglish
Article number5299257
Pages (from-to)825-831
Number of pages7
JournalIEEE Transactions on Components and Packaging Technologies
Volume32
Issue number4
DOIs
Publication statusPublished - 2009 Dec 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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