We present a framework to calculate the thermal resistance of AuSn eutectic solder joint (R th, Au-Sn joint) in high brightness light emitting diode (HB LED) packages whose heat extraction capability controls the optical efficiency and reliability of HB LEDs. Using the transient thermal measurement combined with the structure function based analytical method and the finite element method, we find that the thermal conductivity (k) of the thin solder joint becomes significantly smaller than the AuSn alloy after joining; hence, R th, Au-Sn joint constitutes a large portion of the total R th of the package (R th PKG).
|Number of pages||7|
|Journal||IEEE Transactions on Components and Packaging Technologies|
|Publication status||Published - 2009 Dec 1|
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering