The use of metal filled via holes for improving isolation in ltcc rf and wireless multichip packages

George E. Ponchak, Donghoon Chun, Jong Gwan Yook

Research output: Contribution to journalArticle

69 Citations (Scopus)

Abstract

LTCC MCM's for RF and wireless systems often use metal filled via holes to improve isolation between the stripline and microstrip interconnects. In this paper, results from a 3D-FEM electromagnetic characterization of microstrip and stripline interconnects with metal filled via fences for isolation are presented. It is shown that placement of a via hole fence closer than three times the substrate height to the transmission lines increases radiation and coupling. Radiation loss and reflections are increased when a short via fence is used in areas suspected of having high radiation. Also, via posts should not be separated by more than three times the substrate height for low radiation loss, coupling, and suppression of higher order modes in a package.

Original languageEnglish
Pages (from-to)88-99
Number of pages12
JournalIEEE Transactions on Advanced Packaging
Volume23
Issue number1
DOIs
Publication statusPublished - 2000 Feb 1

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Fences
Radiation
Metals
Multicarrier modulation
Substrates
Electric lines
Finite element method

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

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The use of metal filled via holes for improving isolation in ltcc rf and wireless multichip packages. / Ponchak, George E.; Chun, Donghoon; Yook, Jong Gwan.

In: IEEE Transactions on Advanced Packaging, Vol. 23, No. 1, 01.02.2000, p. 88-99.

Research output: Contribution to journalArticle

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