The use of metal filled via holes for improving isolation in ltcc rf and wireless multichip packages

George E. Ponchak, Donghoon Chun, Jong Gwan Yook

Research output: Contribution to journalArticlepeer-review

69 Citations (Scopus)

Abstract

LTCC MCM's for RF and wireless systems often use metal filled via holes to improve isolation between the stripline and microstrip interconnects. In this paper, results from a 3D-FEM electromagnetic characterization of microstrip and stripline interconnects with metal filled via fences for isolation are presented. It is shown that placement of a via hole fence closer than three times the substrate height to the transmission lines increases radiation and coupling. Radiation loss and reflections are increased when a short via fence is used in areas suspected of having high radiation. Also, via posts should not be separated by more than three times the substrate height for low radiation loss, coupling, and suppression of higher order modes in a package.

Original languageEnglish
Pages (from-to)88-99
Number of pages12
JournalIEEE Transactions on Advanced Packaging
Volume23
Issue number1
DOIs
Publication statusPublished - 2000 Feb

Bibliographical note

Funding Information:
Manuscript received November 25, 1998; revised November 30, 1999. This work was presented in part at the 3rd International Wireless Communications Conference (WCC ’98), San Diego, CA, November 1–3, 1998 and the 1998 IEEE MTT-S International Microwave Symposium, Baltimore, MD, June 7–12, 1998. This work was supported by the NASA Glenn Research Center and the University of Michigan Center for Parallel Computing, which is supported in part by NSF Grant CDA-92-14296 and the Ford Motor Company.

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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