Thermal analysis and design of high power LED packages and systems

Lan Kim, Moo Whan Shin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

13 Citations (Scopus)

Abstract

Thermal transient measurements of high power GaN-based LEDs with multi-chip designs are presented and discussed in the paper. Once transient cooling curve was obtained, the structure function theory was applied to determine the thermal resistance of packages. The total thermal resistance from junction to ambient considering optical power is 19.87 K/W, 10.78 K/W, 6.77 K/W for the one-chip, two-chip and four-chip packages, respectively. The contribution of each component to the total thermal resistance of the package can be determined from the cumulative structure function and differential structure function. The total thermal resistance of multi-chip packages is found to decrease with the number of chips due to parallel heat dissipation. However, the effect of the number of chips on thermal resistance of package strongly depends on the ratio of partial thermal resistance of chip and that of slug. Therefore, an important thermal design rule for packaging of high power multi-chip LEDs has been analogized.

Original languageEnglish
Title of host publicationSixth International Conference on Solid State Lighting
DOIs
Publication statusPublished - 2006 Nov 23
EventSixth International Conference on Solid State Lighting - San Diego, CA, United States
Duration: 2006 Aug 142006 Aug 17

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume6337
ISSN (Print)0277-786X

Other

OtherSixth International Conference on Solid State Lighting
CountryUnited States
CitySan Diego, CA
Period06/8/1406/8/17

Fingerprint

Thermal Analysis
Heat resistance
High Power
Thermoanalysis
Light emitting diodes
Thermal Resistance
thermal analysis
Chip
light emitting diodes
chips
thermal resistance
Structure-function
Heat losses
cooling
Design
Packaging
Design Rules
Cooling
packaging
Dissipation

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Kim, L., & Shin, M. W. (2006). Thermal analysis and design of high power LED packages and systems. In Sixth International Conference on Solid State Lighting [63370U] (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 6337). https://doi.org/10.1117/12.687681
Kim, Lan ; Shin, Moo Whan. / Thermal analysis and design of high power LED packages and systems. Sixth International Conference on Solid State Lighting. 2006. (Proceedings of SPIE - The International Society for Optical Engineering).
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Kim, L & Shin, MW 2006, Thermal analysis and design of high power LED packages and systems. in Sixth International Conference on Solid State Lighting., 63370U, Proceedings of SPIE - The International Society for Optical Engineering, vol. 6337, Sixth International Conference on Solid State Lighting, San Diego, CA, United States, 06/8/14. https://doi.org/10.1117/12.687681

Thermal analysis and design of high power LED packages and systems. / Kim, Lan; Shin, Moo Whan.

Sixth International Conference on Solid State Lighting. 2006. 63370U (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 6337).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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AB - Thermal transient measurements of high power GaN-based LEDs with multi-chip designs are presented and discussed in the paper. Once transient cooling curve was obtained, the structure function theory was applied to determine the thermal resistance of packages. The total thermal resistance from junction to ambient considering optical power is 19.87 K/W, 10.78 K/W, 6.77 K/W for the one-chip, two-chip and four-chip packages, respectively. The contribution of each component to the total thermal resistance of the package can be determined from the cumulative structure function and differential structure function. The total thermal resistance of multi-chip packages is found to decrease with the number of chips due to parallel heat dissipation. However, the effect of the number of chips on thermal resistance of package strongly depends on the ratio of partial thermal resistance of chip and that of slug. Therefore, an important thermal design rule for packaging of high power multi-chip LEDs has been analogized.

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Kim L, Shin MW. Thermal analysis and design of high power LED packages and systems. In Sixth International Conference on Solid State Lighting. 2006. 63370U. (Proceedings of SPIE - The International Society for Optical Engineering). https://doi.org/10.1117/12.687681