Thermal analysis and modeling of led arrays for automotive headlamp

Sun Ho Jang, Moo Whan Shin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper we report the thermal performance of LED head lamp module and the cooling system. The precise fluid field modeling and heat transfer analysis using a CFD (Computational Fluid Dynamics) were performed according tothe practical working conditions for the headlamp. The junction temperatures of LEDs were found to decrease by using the air cooling system and thus improved the heat dissipating capability of the LED array. The junction temperature of the LED array was decreased from 70.6 • to 30.25 • when the circulating speed of the air increased from 0 km/h to 120 km/h. And the temperature decrease of 2~4 • was obtained by using fins. By the thermal analysis, a new thermal design was obtained for the cooling system of LED arrays for the headlamps. Thus the reliability of the headlamp with LED arrays can be improved with a good cooling system.

Original languageEnglish
Title of host publicationElectronics and Photonics
PublisherAmerican Society of Mechanical Engineers (ASME)
Pages247-250
Number of pages4
ISBN (Electronic)0791842991
DOIs
Publication statusPublished - 2007 Jan 1
EventASME 2007 International Mechanical Engineering Congress and Exposition, IMECE 2007 - Seattle, United States
Duration: 2007 Nov 112007 Nov 15

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Volume5

Other

OtherASME 2007 International Mechanical Engineering Congress and Exposition, IMECE 2007
CountryUnited States
CitySeattle
Period07/11/1107/11/15

Fingerprint

Thermoanalysis
Light emitting diodes
Cooling systems
Air
Electric lamps
Temperature
Computational fluid dynamics
Heat transfer
Fluids
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering

Cite this

Jang, S. H., & Shin, M. W. (2007). Thermal analysis and modeling of led arrays for automotive headlamp. In Electronics and Photonics (pp. 247-250). (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); Vol. 5). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/IMECE200741756
Jang, Sun Ho ; Shin, Moo Whan. / Thermal analysis and modeling of led arrays for automotive headlamp. Electronics and Photonics. American Society of Mechanical Engineers (ASME), 2007. pp. 247-250 (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)).
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Jang, SH & Shin, MW 2007, Thermal analysis and modeling of led arrays for automotive headlamp. in Electronics and Photonics. ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), vol. 5, American Society of Mechanical Engineers (ASME), pp. 247-250, ASME 2007 International Mechanical Engineering Congress and Exposition, IMECE 2007, Seattle, United States, 07/11/11. https://doi.org/10.1115/IMECE200741756

Thermal analysis and modeling of led arrays for automotive headlamp. / Jang, Sun Ho; Shin, Moo Whan.

Electronics and Photonics. American Society of Mechanical Engineers (ASME), 2007. p. 247-250 (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); Vol. 5).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Jang SH, Shin MW. Thermal analysis and modeling of led arrays for automotive headlamp. In Electronics and Photonics. American Society of Mechanical Engineers (ASME). 2007. p. 247-250. (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)). https://doi.org/10.1115/IMECE200741756