Thermal analysis and modeling of led arrays for automotive headlamp

Sun Ho Jang, Moo Whan Shin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In this paper we report the thermal performance of LED head lamp module and the cooling system. The precise fluid field modeling and heat transfer analysis using a CFD (Computational Fluid Dynamics) were performed according to the practical working conditions for the headlamp. The junction temperatures of LEDs were found to decrease by using the air cooling system and thus improved the heat dissipating capability of the LED array. The junction temperature of the LED array was decreased from 70.6 °C to 30.25 °C when the circulating speed of the air increased from 0 km/h to 120 km/h. And the temperature decrease of 2-4 °C was obtained by using fins. By the thermal analysis, a new thermal design was obtained for the cooling system of LED arrays for the headlamps. Thus the reliability of the headlamp with LED arrays can be improved with a good cooling system.

Original languageEnglish
Title of host publicationProceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007
Pages247-250
Number of pages4
Volume5
DOIs
Publication statusPublished - 2008 May 28
EventASME International Mechanical Engineering Congress and Exposition, IMECE 2007 - Seattle, WA, United States
Duration: 2007 Nov 112007 Nov 15

Other

OtherASME International Mechanical Engineering Congress and Exposition, IMECE 2007
CountryUnited States
CitySeattle, WA
Period07/11/1107/11/15

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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  • Cite this

    Jang, S. H., & Shin, M. W. (2008). Thermal analysis and modeling of led arrays for automotive headlamp. In Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007 (Vol. 5, pp. 247-250) https://doi.org/10.1115/IMECE2007-41756