Thermal analysis in a film cooling hole with thermal barrier coating

Dong Hyun Lee, Kyung Min Kim, Sangwoo Shin, Hyung Hee Cho

Research output: Contribution to journalArticle

12 Citations (Scopus)

Abstract

The thickening of tolerable thermal barrier coatings (TBC) at each main hot flow temperature with a film cooling system of normal injection was examined. The thermal analysis was performed using a commercial code, ANSYS Workbench-11 to calculate the thermal stress. The mapped grid was selected for the mesh construction and the geometry consisted of approximately 30,000 elements. The minimum TBC thickness for various main hot gas flow temperatures was determined by making correlations upon TBC thickness and main hot gas temperature using the response surface method. The maximum material temperature of TBC and substrate as well as the maximum debonding stress were obtained from the correlations at any TBC thickness and main hot gas flow temperature. The results revealed that the thick TBC generates a rise in TBC temperature, but a drop in substrate temperature. The TBC thickness at any main hot gas temperature must be carefully considered because both the thin and thick TBC are weak at debonding stress and thermal cycle respectively.

Original languageEnglish
Pages (from-to)843-846
Number of pages4
JournalJournal of Thermophysics and Heat Transfer
Volume23
Issue number4
DOIs
Publication statusPublished - 2009

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Aerospace Engineering
  • Mechanical Engineering
  • Fluid Flow and Transfer Processes
  • Space and Planetary Science

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