Thermal analysis of GaN-based LEDs using the finite element method and unit temperature profile approach

Tae Hee Lee, Lan Kim, Woong Joon Hwang, C. C. Lee, Moo Whan Shin

Research output: Contribution to journalArticle

17 Citations (Scopus)

Abstract

This paper reports on the thermal modelling of GaN-based LEDs. The theoretical calculation was made by combining an analytical simulation employing the Unit Temperature Profile Approach (UTPA) and Finite Element Method (FEM). An interfacing process was made by the optimization of the modelling input parameters used in the analytical simulator. The calculated temperatures of the LED chip inside the epoxy package was compared with the experimentally measured data and the optimized heat transfer coefficients were extracted. The extracted parameters were implemented into the numerical thermal calculation of the package surface using FEM. By the effective interfacing process between the two modelling tools, it is demonstrated that the analytical simulator can be utilized for the accurate prediction of the surface temperatures of LED packaging with non-flat surface.

Original languageEnglish
Pages (from-to)2681-2684
Number of pages4
JournalPhysica Status Solidi (B) Basic Research
Volume241
Issue number12
DOIs
Publication statusPublished - 2004 Oct 1

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temperature profiles
Thermoanalysis
Light emitting diodes
finite element method
thermal analysis
light emitting diodes
Finite element method
simulators
Simulators
heat transfer coefficients
packaging
Temperature
Heat transfer coefficients
surface temperature
Packaging
chips
optimization
predictions
simulation
temperature

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Cite this

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abstract = "This paper reports on the thermal modelling of GaN-based LEDs. The theoretical calculation was made by combining an analytical simulation employing the Unit Temperature Profile Approach (UTPA) and Finite Element Method (FEM). An interfacing process was made by the optimization of the modelling input parameters used in the analytical simulator. The calculated temperatures of the LED chip inside the epoxy package was compared with the experimentally measured data and the optimized heat transfer coefficients were extracted. The extracted parameters were implemented into the numerical thermal calculation of the package surface using FEM. By the effective interfacing process between the two modelling tools, it is demonstrated that the analytical simulator can be utilized for the accurate prediction of the surface temperatures of LED packaging with non-flat surface.",
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Thermal analysis of GaN-based LEDs using the finite element method and unit temperature profile approach. / Lee, Tae Hee; Kim, Lan; Hwang, Woong Joon; Lee, C. C.; Shin, Moo Whan.

In: Physica Status Solidi (B) Basic Research, Vol. 241, No. 12, 01.10.2004, p. 2681-2684.

Research output: Contribution to journalArticle

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