Abstract
This paper reports on the thermal modelling of GaN-based LEDs. The theoretical calculation was made by combining an analytical simulation employing the Unit Temperature Profile Approach (UTPA) and Finite Element Method (FEM). An interfacing process was made by the optimization of the modelling input parameters used in the analytical simulator. The calculated temperatures of the LED chip inside the epoxy package was compared with the experimentally measured data and the optimized heat transfer coefficients were extracted. The extracted parameters were implemented into the numerical thermal calculation of the package surface using FEM. By the effective interfacing process between the two modelling tools, it is demonstrated that the analytical simulator can be utilized for the accurate prediction of the surface temperatures of LED packaging with non-flat surface.
| Original language | English |
|---|---|
| Pages (from-to) | 2681-2684 |
| Number of pages | 4 |
| Journal | Physica Status Solidi (B) Basic Research |
| Volume | 241 |
| Issue number | 12 |
| DOIs | |
| Publication status | Published - 2004 Oct 1 |
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All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
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Thermal analysis of GaN-based LEDs using the finite element method and unit temperature profile approach. / Lee, Tae Hee; Kim, Lan; Hwang, Woong Joon; Lee, C. C.; Shin, Moo Whan.
In: Physica Status Solidi (B) Basic Research, Vol. 241, No. 12, 01.10.2004, p. 2681-2684.Research output: Contribution to journal › Article
TY - JOUR
T1 - Thermal analysis of GaN-based LEDs using the finite element method and unit temperature profile approach
AU - Lee, Tae Hee
AU - Kim, Lan
AU - Hwang, Woong Joon
AU - Lee, C. C.
AU - Shin, Moo Whan
PY - 2004/10/1
Y1 - 2004/10/1
N2 - This paper reports on the thermal modelling of GaN-based LEDs. The theoretical calculation was made by combining an analytical simulation employing the Unit Temperature Profile Approach (UTPA) and Finite Element Method (FEM). An interfacing process was made by the optimization of the modelling input parameters used in the analytical simulator. The calculated temperatures of the LED chip inside the epoxy package was compared with the experimentally measured data and the optimized heat transfer coefficients were extracted. The extracted parameters were implemented into the numerical thermal calculation of the package surface using FEM. By the effective interfacing process between the two modelling tools, it is demonstrated that the analytical simulator can be utilized for the accurate prediction of the surface temperatures of LED packaging with non-flat surface.
AB - This paper reports on the thermal modelling of GaN-based LEDs. The theoretical calculation was made by combining an analytical simulation employing the Unit Temperature Profile Approach (UTPA) and Finite Element Method (FEM). An interfacing process was made by the optimization of the modelling input parameters used in the analytical simulator. The calculated temperatures of the LED chip inside the epoxy package was compared with the experimentally measured data and the optimized heat transfer coefficients were extracted. The extracted parameters were implemented into the numerical thermal calculation of the package surface using FEM. By the effective interfacing process between the two modelling tools, it is demonstrated that the analytical simulator can be utilized for the accurate prediction of the surface temperatures of LED packaging with non-flat surface.
UR - http://www.scopus.com/inward/record.url?scp=7444229734&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=7444229734&partnerID=8YFLogxK
U2 - 10.1002/pssb.200405099
DO - 10.1002/pssb.200405099
M3 - Article
VL - 241
SP - 2681
EP - 2684
JO - Physica Status Solidi (B): Basic Research
JF - Physica Status Solidi (B): Basic Research
SN - 0370-1972
IS - 12
ER -