Thermal analysis of GaN-based light emitting diodes with different chip sizes

Lianqiao Yang, Jianzheng Hu, Lan Kim, Moo Whan Shin

Research output: Contribution to journalArticlepeer-review

19 Citations (Scopus)

Abstract

In this paper, we present the thermal, electrical, and optical analyses of light emitting diode (LED) packages with different chip sizes. The LED packages under investigation employed the same configuration of package components, except for the chip sizes. The forward current was found to increase with the chip size at the same forward voltage due to the area increase of current spreading. The luminous flux and optical power were found to increase with the chip size at the same current density. The thermal analysis was made by the transient thermal measurement and thermal simulation using the finite volume method. It was demonstrated that the thermal resistance decreased with the chip size under the same package conditions both by simulation and experiment. The bulk thermal resistance and spreading thermal resistance were combined together to give out a quantitative investigation of the partial thermal resistance variation. Moreover, the spreading thermal resistance was found to have a great effect on the total thermal resistance of LED packages.

Original languageEnglish
Article number4655585
Pages (from-to)571-575
Number of pages5
JournalIEEE Transactions on Device and Materials Reliability
Volume8
Issue number3
DOIs
Publication statusPublished - 2008 Sep

Bibliographical note

Funding Information:
Manuscript received December 1, 2007; revised March 9, 2008. Current version published October 16, 2008. This work was supported by the Korea Energy Management Corporation. L. Yang, J. Hu, and M. W. Shin are with the Department of Materials Science and Engineering, Myongji University, Yongin 449-728, Korea (e-mail: mwshin@mju.ac.kr). L. Kim is with LG Display, Seoul 413-811, Korea. Color versions of one or more of the figures in this paper are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/TDMR.2008.2002357 Fig. 1. V –I curve of the LED packages. Insets are the micrographs of electrode patterns for different chip sizes.

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Safety, Risk, Reliability and Quality
  • Electrical and Electronic Engineering

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