Thermal analysis of high power LED packages under the alternating current operation

Moo Whan Shin, Sun Ho Jang

Research output: Contribution to journalArticle

42 Citations (Scopus)

Abstract

In this paper we describe a novel thermal characterization method of GaN-based Light Emitting Diode (LED) package driven under the Alternating Current (AC) mode. The result was compared with the results from the thermal analysis for LED package operated under the Direct Current (DC) condition. Different from the DC condition, the junction temperature rise with the operation time of LED package was exhibited in a band formation. Finite Volume Method (FVM) was utilized to calculate the thermal performance of LED package under the AC condition using the input power extracted from the output current and voltage from the AC power supply. The experimental result was in a good agreement with the simulation data.

Original languageEnglish
Pages (from-to)48-50
Number of pages3
JournalSolid-State Electronics
Volume68
DOIs
Publication statusPublished - 2012 Feb 1

Fingerprint

Thermoanalysis
Light emitting diodes
alternating current
thermal analysis
light emitting diodes
direct current
finite volume method
Finite volume method
data simulation
power supplies
output
Electric potential
electric potential
Temperature
temperature
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials
  • Materials Chemistry

Cite this

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Thermal analysis of high power LED packages under the alternating current operation. / Shin, Moo Whan; Jang, Sun Ho.

In: Solid-State Electronics, Vol. 68, 01.02.2012, p. 48-50.

Research output: Contribution to journalArticle

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