Thermal analysis of high power LEDs at working conditions

S. H. Jang; M. W. Shin

doi:10.1109/IPFA.2011.5992721

Thermal analysis of high power LEDs at working conditions

S. H. Jang, M. W. Shin

School of Integrated Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

In this paper, we present the thermal analysis of high-power light-emitting diodes (LEDs) with under the real operating conditions. Thermal transient measurements were performed to study the thermal characteristics of high power LED packages. The effects of working conditions such as the ambient temperature, working time, cooling element, and the applied pressure on the thermal performance of high power LED package were investigated. The results indicate that the design with thermal characteristic is imperative for reliable operation of the high power LED package.

Original language	English
Title of host publication	18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011
DOIs	https://doi.org/10.1109/IPFA.2011.5992721
Publication status	Published - 2011 Sep 15
Event	18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011 - Incheon, Korea, Republic of Duration: 2011 Jul 4 → 2011 Jul 7

Publication series

Name	Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Other

Other	18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011
Country	Korea, Republic of
City	Incheon
Period	11/7/4 → 11/7/7

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All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

Cite this

Jang, S. H., & Shin, M. W. (2011). Thermal analysis of high power LEDs at working conditions. In 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011 [5992721] (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). https://doi.org/10.1109/IPFA.2011.5992721

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abstract = "In this paper, we present the thermal analysis of high-power light-emitting diodes (LEDs) with under the real operating conditions. Thermal transient measurements were performed to study the thermal characteristics of high power LED packages. The effects of working conditions such as the ambient temperature, working time, cooling element, and the applied pressure on the thermal performance of high power LED package were investigated. The results indicate that the design with thermal characteristic is imperative for reliable operation of the high power LED package.",

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Jang, SH & Shin, MW 2011, Thermal analysis of high power LEDs at working conditions. in 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011., 5992721, Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011, Incheon, Korea, Republic of, 11/7/4. https://doi.org/10.1109/IPFA.2011.5992721

Thermal analysis of high power LEDs at working conditions. / Jang, S. H.; Shin, M. W.

18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011. 2011. 5992721 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AB - In this paper, we present the thermal analysis of high-power light-emitting diodes (LEDs) with under the real operating conditions. Thermal transient measurements were performed to study the thermal characteristics of high power LED packages. The effects of working conditions such as the ambient temperature, working time, cooling element, and the applied pressure on the thermal performance of high power LED package were investigated. The results indicate that the design with thermal characteristic is imperative for reliable operation of the high power LED package.

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Access to Document

10.1109/IPFA.2011.5992721