Thermal analysis of high power LEDs at working conditions

S. H. Jang, M. W. Shin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In this paper, we present the thermal analysis of high-power light-emitting diodes (LEDs) with under the real operating conditions. Thermal transient measurements were performed to study the thermal characteristics of high power LED packages. The effects of working conditions such as the ambient temperature, working time, cooling element, and the applied pressure on the thermal performance of high power LED package were investigated. The results indicate that the design with thermal characteristic is imperative for reliable operation of the high power LED package.

Original languageEnglish
Title of host publication18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011
DOIs
Publication statusPublished - 2011 Sep 15
Event18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011 - Incheon, Korea, Republic of
Duration: 2011 Jul 42011 Jul 7

Publication series

NameProceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Other

Other18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011
CountryKorea, Republic of
CityIncheon
Period11/7/411/7/7

Fingerprint

Thermoanalysis
Light emitting diodes
Cooling
Hot Temperature
Temperature

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Jang, S. H., & Shin, M. W. (2011). Thermal analysis of high power LEDs at working conditions. In 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011 [5992721] (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). https://doi.org/10.1109/IPFA.2011.5992721
Jang, S. H. ; Shin, M. W. / Thermal analysis of high power LEDs at working conditions. 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011. 2011. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).
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abstract = "In this paper, we present the thermal analysis of high-power light-emitting diodes (LEDs) with under the real operating conditions. Thermal transient measurements were performed to study the thermal characteristics of high power LED packages. The effects of working conditions such as the ambient temperature, working time, cooling element, and the applied pressure on the thermal performance of high power LED package were investigated. The results indicate that the design with thermal characteristic is imperative for reliable operation of the high power LED package.",
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Jang, SH & Shin, MW 2011, Thermal analysis of high power LEDs at working conditions. in 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011., 5992721, Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011, Incheon, Korea, Republic of, 11/7/4. https://doi.org/10.1109/IPFA.2011.5992721

Thermal analysis of high power LEDs at working conditions. / Jang, S. H.; Shin, M. W.

18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011. 2011. 5992721 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Jang SH, Shin MW. Thermal analysis of high power LEDs at working conditions. In 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011. 2011. 5992721. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). https://doi.org/10.1109/IPFA.2011.5992721