TY - GEN
T1 - Thermal analysis of high power LEDs at working conditions
AU - Jang, S. H.
AU - Shin, M. W.
PY - 2011
Y1 - 2011
N2 - In this paper, we present the thermal analysis of high-power light-emitting diodes (LEDs) with under the real operating conditions. Thermal transient measurements were performed to study the thermal characteristics of high power LED packages. The effects of working conditions such as the ambient temperature, working time, cooling element, and the applied pressure on the thermal performance of high power LED package were investigated. The results indicate that the design with thermal characteristic is imperative for reliable operation of the high power LED package.
AB - In this paper, we present the thermal analysis of high-power light-emitting diodes (LEDs) with under the real operating conditions. Thermal transient measurements were performed to study the thermal characteristics of high power LED packages. The effects of working conditions such as the ambient temperature, working time, cooling element, and the applied pressure on the thermal performance of high power LED package were investigated. The results indicate that the design with thermal characteristic is imperative for reliable operation of the high power LED package.
UR - http://www.scopus.com/inward/record.url?scp=80052623712&partnerID=8YFLogxK
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U2 - 10.1109/IPFA.2011.5992721
DO - 10.1109/IPFA.2011.5992721
M3 - Conference contribution
AN - SCOPUS:80052623712
SN - 9781457701597
T3 - Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
BT - 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011
T2 - 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011
Y2 - 4 July 2011 through 7 July 2011
ER -