Abstract
In this paper, we present the thermal analysis of high-power light-emitting diodes (LEDs) with under the real operating conditions. Thermal transient measurements were performed to study the thermal characteristics of high power LED packages. The effects of working conditions such as the ambient temperature, working time, cooling element, and the applied pressure on the thermal performance of high power LED package were investigated. The results indicate that the design with thermal characteristic is imperative for reliable operation of the high power LED package.
| Original language | English |
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| Title of host publication | 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011 |
| DOIs | |
| Publication status | Published - 2011 Sep 15 |
| Event | 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011 - Incheon, Korea, Republic of Duration: 2011 Jul 4 → 2011 Jul 7 |
Publication series
| Name | Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA |
|---|
Other
| Other | 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011 |
|---|---|
| Country | Korea, Republic of |
| City | Incheon |
| Period | 11/7/4 → 11/7/7 |
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All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering
Cite this
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Thermal analysis of high power LEDs at working conditions. / Jang, S. H.; Shin, M. W.
18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011. 2011. 5992721 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Thermal analysis of high power LEDs at working conditions
AU - Jang, S. H.
AU - Shin, M. W.
PY - 2011/9/15
Y1 - 2011/9/15
N2 - In this paper, we present the thermal analysis of high-power light-emitting diodes (LEDs) with under the real operating conditions. Thermal transient measurements were performed to study the thermal characteristics of high power LED packages. The effects of working conditions such as the ambient temperature, working time, cooling element, and the applied pressure on the thermal performance of high power LED package were investigated. The results indicate that the design with thermal characteristic is imperative for reliable operation of the high power LED package.
AB - In this paper, we present the thermal analysis of high-power light-emitting diodes (LEDs) with under the real operating conditions. Thermal transient measurements were performed to study the thermal characteristics of high power LED packages. The effects of working conditions such as the ambient temperature, working time, cooling element, and the applied pressure on the thermal performance of high power LED package were investigated. The results indicate that the design with thermal characteristic is imperative for reliable operation of the high power LED package.
UR - http://www.scopus.com/inward/record.url?scp=80052623712&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=80052623712&partnerID=8YFLogxK
U2 - 10.1109/IPFA.2011.5992721
DO - 10.1109/IPFA.2011.5992721
M3 - Conference contribution
AN - SCOPUS:80052623712
SN - 9781457701597
T3 - Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
BT - 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011
ER -