Thermal analysis of multi-chip LED packages

Lan Kim, Jonghwa Choi, Sunho Jang, Moo Whan Shin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Thermal transient measurements of high power GaN-based LEDs with multi-chip designs are presented and discussed. Once transient cooling curve was obtained, the structure function theory was applied to determine the thermal resistance of packages. The measured total thermal resistances from junction to ambient were 19.87 K/W, 10.78 K/W, 6.77 K/W for the one-chip, two-chip and four-chip package, respectively. The contribution of each component to the total thermal resistance of the package can be calculated from the cumulative structure function and differential structure function. The total thermal resistance of multi-chip package is found to decrease with the number of chips due to parallel heat dissipation. Very useful thermal design rule for high power multi-chip LED package is analogized from the experiments. It was found that the effect of the number of chips in a package on the thermal resistance depends on the ratio of partial thermal resistance of chip and that of slug. Thermal resistance for full color multi chip LEDs, where each chip is driven independently, was measured as well and the implication was discussed.

Original languageEnglish
Title of host publicationAdvanced LEDs for Solid State Lighting
Volume6355
DOIs
Publication statusPublished - 2006 Dec 27
EventAdvanced LEDs for Solid State Lighting - Gwangju, Korea, Republic of
Duration: 2006 Sep 52006 Sep 7

Other

OtherAdvanced LEDs for Solid State Lighting
CountryKorea, Republic of
CityGwangju
Period06/9/506/9/7

Fingerprint

Thermal Analysis
Heat resistance
Thermoanalysis
Light emitting diodes
thermal analysis
Thermal Resistance
Chip
light emitting diodes
chips
thermal resistance
Structure-function
High Power
Heat losses
cooling
Design Rules
Cooling
Color
Dissipation
Heat
color

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Kim, L., Choi, J., Jang, S., & Shin, M. W. (2006). Thermal analysis of multi-chip LED packages. In Advanced LEDs for Solid State Lighting (Vol. 6355). [63550E] https://doi.org/10.1117/12.691560
Kim, Lan ; Choi, Jonghwa ; Jang, Sunho ; Shin, Moo Whan. / Thermal analysis of multi-chip LED packages. Advanced LEDs for Solid State Lighting. Vol. 6355 2006.
@inproceedings{cfc820c7de544a42870c3f5e6496510e,
title = "Thermal analysis of multi-chip LED packages",
abstract = "Thermal transient measurements of high power GaN-based LEDs with multi-chip designs are presented and discussed. Once transient cooling curve was obtained, the structure function theory was applied to determine the thermal resistance of packages. The measured total thermal resistances from junction to ambient were 19.87 K/W, 10.78 K/W, 6.77 K/W for the one-chip, two-chip and four-chip package, respectively. The contribution of each component to the total thermal resistance of the package can be calculated from the cumulative structure function and differential structure function. The total thermal resistance of multi-chip package is found to decrease with the number of chips due to parallel heat dissipation. Very useful thermal design rule for high power multi-chip LED package is analogized from the experiments. It was found that the effect of the number of chips in a package on the thermal resistance depends on the ratio of partial thermal resistance of chip and that of slug. Thermal resistance for full color multi chip LEDs, where each chip is driven independently, was measured as well and the implication was discussed.",
author = "Lan Kim and Jonghwa Choi and Sunho Jang and Shin, {Moo Whan}",
year = "2006",
month = "12",
day = "27",
doi = "10.1117/12.691560",
language = "English",
isbn = "0819464503",
volume = "6355",
booktitle = "Advanced LEDs for Solid State Lighting",

}

Kim, L, Choi, J, Jang, S & Shin, MW 2006, Thermal analysis of multi-chip LED packages. in Advanced LEDs for Solid State Lighting. vol. 6355, 63550E, Advanced LEDs for Solid State Lighting, Gwangju, Korea, Republic of, 06/9/5. https://doi.org/10.1117/12.691560

Thermal analysis of multi-chip LED packages. / Kim, Lan; Choi, Jonghwa; Jang, Sunho; Shin, Moo Whan.

Advanced LEDs for Solid State Lighting. Vol. 6355 2006. 63550E.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Thermal analysis of multi-chip LED packages

AU - Kim, Lan

AU - Choi, Jonghwa

AU - Jang, Sunho

AU - Shin, Moo Whan

PY - 2006/12/27

Y1 - 2006/12/27

N2 - Thermal transient measurements of high power GaN-based LEDs with multi-chip designs are presented and discussed. Once transient cooling curve was obtained, the structure function theory was applied to determine the thermal resistance of packages. The measured total thermal resistances from junction to ambient were 19.87 K/W, 10.78 K/W, 6.77 K/W for the one-chip, two-chip and four-chip package, respectively. The contribution of each component to the total thermal resistance of the package can be calculated from the cumulative structure function and differential structure function. The total thermal resistance of multi-chip package is found to decrease with the number of chips due to parallel heat dissipation. Very useful thermal design rule for high power multi-chip LED package is analogized from the experiments. It was found that the effect of the number of chips in a package on the thermal resistance depends on the ratio of partial thermal resistance of chip and that of slug. Thermal resistance for full color multi chip LEDs, where each chip is driven independently, was measured as well and the implication was discussed.

AB - Thermal transient measurements of high power GaN-based LEDs with multi-chip designs are presented and discussed. Once transient cooling curve was obtained, the structure function theory was applied to determine the thermal resistance of packages. The measured total thermal resistances from junction to ambient were 19.87 K/W, 10.78 K/W, 6.77 K/W for the one-chip, two-chip and four-chip package, respectively. The contribution of each component to the total thermal resistance of the package can be calculated from the cumulative structure function and differential structure function. The total thermal resistance of multi-chip package is found to decrease with the number of chips due to parallel heat dissipation. Very useful thermal design rule for high power multi-chip LED package is analogized from the experiments. It was found that the effect of the number of chips in a package on the thermal resistance depends on the ratio of partial thermal resistance of chip and that of slug. Thermal resistance for full color multi chip LEDs, where each chip is driven independently, was measured as well and the implication was discussed.

UR - http://www.scopus.com/inward/record.url?scp=33845619969&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33845619969&partnerID=8YFLogxK

U2 - 10.1117/12.691560

DO - 10.1117/12.691560

M3 - Conference contribution

AN - SCOPUS:33845619969

SN - 0819464503

SN - 9780819464507

VL - 6355

BT - Advanced LEDs for Solid State Lighting

ER -

Kim L, Choi J, Jang S, Shin MW. Thermal analysis of multi-chip LED packages. In Advanced LEDs for Solid State Lighting. Vol. 6355. 2006. 63550E https://doi.org/10.1117/12.691560