Abstract
Thermal transient measurements of high power GaN-based LEDs with multi-chip designs are presented and discussed. Once transient cooling curve was obtained, the structure function theory was applied to determine the thermal resistance of packages. The measured total thermal resistances from junction to ambient were 19.87 K/W, 10.78 K/W, 6.77 K/W for the one-chip, two-chip and four-chip package, respectively. The contribution of each component to the total thermal resistance of the package can be calculated from the cumulative structure function and differential structure function. The total thermal resistance of multi-chip package is found to decrease with the number of chips due to parallel heat dissipation. Very useful thermal design rule for high power multi-chip LED package is analogized from the experiments. It was found that the effect of the number of chips in a package on the thermal resistance depends on the ratio of partial thermal resistance of chip and that of slug. Thermal resistance for full color multi chip LEDs, where each chip is driven independently, was measured as well and the implication was discussed.
| Original language | English |
|---|---|
| Title of host publication | Advanced LEDs for Solid State Lighting |
| Volume | 6355 |
| DOIs | |
| Publication status | Published - 2006 Dec 27 |
| Event | Advanced LEDs for Solid State Lighting - Gwangju, Korea, Republic of Duration: 2006 Sep 5 → 2006 Sep 7 |
Other
| Other | Advanced LEDs for Solid State Lighting |
|---|---|
| Country | Korea, Republic of |
| City | Gwangju |
| Period | 06/9/5 → 06/9/7 |
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All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering
Cite this
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Thermal analysis of multi-chip LED packages. / Kim, Lan; Choi, Jonghwa; Jang, Sunho; Shin, Moo Whan.
Advanced LEDs for Solid State Lighting. Vol. 6355 2006. 63550E.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Thermal analysis of multi-chip LED packages
AU - Kim, Lan
AU - Choi, Jonghwa
AU - Jang, Sunho
AU - Shin, Moo Whan
PY - 2006/12/27
Y1 - 2006/12/27
N2 - Thermal transient measurements of high power GaN-based LEDs with multi-chip designs are presented and discussed. Once transient cooling curve was obtained, the structure function theory was applied to determine the thermal resistance of packages. The measured total thermal resistances from junction to ambient were 19.87 K/W, 10.78 K/W, 6.77 K/W for the one-chip, two-chip and four-chip package, respectively. The contribution of each component to the total thermal resistance of the package can be calculated from the cumulative structure function and differential structure function. The total thermal resistance of multi-chip package is found to decrease with the number of chips due to parallel heat dissipation. Very useful thermal design rule for high power multi-chip LED package is analogized from the experiments. It was found that the effect of the number of chips in a package on the thermal resistance depends on the ratio of partial thermal resistance of chip and that of slug. Thermal resistance for full color multi chip LEDs, where each chip is driven independently, was measured as well and the implication was discussed.
AB - Thermal transient measurements of high power GaN-based LEDs with multi-chip designs are presented and discussed. Once transient cooling curve was obtained, the structure function theory was applied to determine the thermal resistance of packages. The measured total thermal resistances from junction to ambient were 19.87 K/W, 10.78 K/W, 6.77 K/W for the one-chip, two-chip and four-chip package, respectively. The contribution of each component to the total thermal resistance of the package can be calculated from the cumulative structure function and differential structure function. The total thermal resistance of multi-chip package is found to decrease with the number of chips due to parallel heat dissipation. Very useful thermal design rule for high power multi-chip LED package is analogized from the experiments. It was found that the effect of the number of chips in a package on the thermal resistance depends on the ratio of partial thermal resistance of chip and that of slug. Thermal resistance for full color multi chip LEDs, where each chip is driven independently, was measured as well and the implication was discussed.
UR - http://www.scopus.com/inward/record.url?scp=33845619969&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=33845619969&partnerID=8YFLogxK
U2 - 10.1117/12.691560
DO - 10.1117/12.691560
M3 - Conference contribution
AN - SCOPUS:33845619969
SN - 0819464503
SN - 9780819464507
VL - 6355
BT - Advanced LEDs for Solid State Lighting
ER -