Thermal analysis of the type of metal design for light emitting diode

So Hyeon Mun, Jong Hwa Choi, Moo Whan Shin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Thermal problem is still a bottleneck to limit the stability, reliability, and lifetime of High power light emitting diodes (LEDs). More effective thermal design LED packages with low thermal resistance is critical to improve the performance of LEDs. In this paper we present thermal analysis of type of thermal performances of the plastic package and metal package of LEDs. The analysis was made by transient thermal measurement. The two kind of ceramic packages under investigation employ same configuration of GaN-based chip, but they have different structure, size and distribution thermal vias. Two design of LED packages resulted in significantly different thermal performance. Thermal properties, described as thermal resistance, of two package design, were compared and evaluated. It was demonstrated that the junction temperature decrease with effective contact in the LED packages.

Original languageEnglish
Title of host publication17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011
Pages49-53
Number of pages5
Publication statusPublished - 2011 Dec 21
Event17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011 - Paris, France
Duration: 2011 Sep 272011 Sep 29

Other

Other17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011
CountryFrance
CityParis
Period11/9/2711/9/29

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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    Mun, S. H., Choi, J. H., & Shin, M. W. (2011). Thermal analysis of the type of metal design for light emitting diode. In 17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011 (pp. 49-53). [6081014]