TY - GEN
T1 - Thermal analysis of the type of metal design for light emitting diode
AU - Mun, So Hyeon
AU - Choi, Jong Hwa
AU - Shin, Moo Whan
PY - 2011
Y1 - 2011
N2 - Thermal problem is still a bottleneck to limit the stability, reliability, and lifetime of High power light emitting diodes (LEDs). More effective thermal design LED packages with low thermal resistance is critical to improve the performance of LEDs. In this paper we present thermal analysis of type of thermal performances of the plastic package and metal package of LEDs. The analysis was made by transient thermal measurement. The two kind of ceramic packages under investigation employ same configuration of GaN-based chip, but they have different structure, size and distribution thermal vias. Two design of LED packages resulted in significantly different thermal performance. Thermal properties, described as thermal resistance, of two package design, were compared and evaluated. It was demonstrated that the junction temperature decrease with effective contact in the LED packages.
AB - Thermal problem is still a bottleneck to limit the stability, reliability, and lifetime of High power light emitting diodes (LEDs). More effective thermal design LED packages with low thermal resistance is critical to improve the performance of LEDs. In this paper we present thermal analysis of type of thermal performances of the plastic package and metal package of LEDs. The analysis was made by transient thermal measurement. The two kind of ceramic packages under investigation employ same configuration of GaN-based chip, but they have different structure, size and distribution thermal vias. Two design of LED packages resulted in significantly different thermal performance. Thermal properties, described as thermal resistance, of two package design, were compared and evaluated. It was demonstrated that the junction temperature decrease with effective contact in the LED packages.
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M3 - Conference contribution
AN - SCOPUS:83655197289
SN - 9782355000171
T3 - 17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011
SP - 49
EP - 53
BT - 17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011
T2 - 17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011
Y2 - 27 September 2011 through 29 September 2011
ER -