Thermal and mechanical analysis of delamination in GaN-based light-emitting diode packages

Jianzheng Hu, Lianqiao Yang, Woong Joon Hwang, Moo Whan Shin

Research output: Contribution to journalConference articlepeer-review

81 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Thermal and mechanical analysis of delamination in GaN-based light-emitting diode packages'. Together they form a unique fingerprint.

Engineering & Materials Science

Physics & Astronomy

Chemical Compounds