Thermal and mechanical analysis of high power leds with ceramic packages

Jianzheng Hu; Lianqiao Yang; Moo Whan Shin

doi:10.1115/IMECE200741759

Thermal and mechanical analysis of high power leds with ceramic packages

Jianzheng Hu, Lianqiao Yang, Moo Whan Shin

School of Integrated Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

6 Citations (Scopus)

Abstract

In this paper we present the thermal and mechanical analysis of high power light emitting diodes with ceramic packages. Transient thermal measurements and thermomechanical simulations were performed to study the thermal and mechanical characteristics of ceramic packages. Thermal resistances from the junction to the ambient were decreased from 76.1 °C/W to 45.3 °C/W by replacing the plastic mould to the ceramic mould for LED packages. Higher level of thermomechanical stress in the chip was found for LEDs with ceramic packages despite of less mismatching coefficients of thermal expansion comparing with plastic packages. The results suggest that the thermal performance of LEDs can be improved by using ceramic packages, but the mounting process of the high power LEDs with ceramic packages is critically important and should be in charge of delaminating interface layers in the packages.

Original language	English
Title of host publication	Electronics and Photonics
Publisher	American Society of Mechanical Engineers (ASME)
Pages	251-255
Number of pages	5
ISBN (Electronic)	0791842991
DOIs	https://doi.org/10.1115/IMECE200741759
Publication status	Published - 2007
Event	ASME 2007 International Mechanical Engineering Congress and Exposition, IMECE 2007 - Seattle, United States Duration: 2007 Nov 11 → 2007 Nov 15

Publication series

Name	ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Volume	5

Other

Other	ASME 2007 International Mechanical Engineering Congress and Exposition, IMECE 2007
Country/Territory	United States
City	Seattle
Period	07/11/11 → 07/11/15

Bibliographical note

Publisher Copyright:
© 2007 by ASME.

All Science Journal Classification (ASJC) codes

Mechanical Engineering

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10.1115/IMECE200741759

Cite this

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title = "Thermal and mechanical analysis of high power leds with ceramic packages",

abstract = "In this paper we present the thermal and mechanical analysis of high power light emitting diodes with ceramic packages. Transient thermal measurements and thermomechanical simulations were performed to study the thermal and mechanical characteristics of ceramic packages. Thermal resistances from the junction to the ambient were decreased from 76.1 °C/W to 45.3 °C/W by replacing the plastic mould to the ceramic mould for LED packages. Higher level of thermomechanical stress in the chip was found for LEDs with ceramic packages despite of less mismatching coefficients of thermal expansion comparing with plastic packages. The results suggest that the thermal performance of LEDs can be improved by using ceramic packages, but the mounting process of the high power LEDs with ceramic packages is critically important and should be in charge of delaminating interface layers in the packages.",

author = "Jianzheng Hu and Lianqiao Yang and Shin, {Moo Whan}",

note = "Publisher Copyright: {\textcopyright} 2007 by ASME.; ASME 2007 International Mechanical Engineering Congress and Exposition, IMECE 2007 ; Conference date: 11-11-2007 Through 15-11-2007",

year = "2007",

doi = "10.1115/IMECE200741759",

language = "English",

series = "ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)",

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booktitle = "Electronics and Photonics",

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Hu, J, Yang, L & Shin, MW 2007, Thermal and mechanical analysis of high power leds with ceramic packages. in Electronics and Photonics. ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), vol. 5, American Society of Mechanical Engineers (ASME), pp. 251-255, ASME 2007 International Mechanical Engineering Congress and Exposition, IMECE 2007, Seattle, United States, 07/11/11. https://doi.org/10.1115/IMECE200741759

Thermal and mechanical analysis of high power leds with ceramic packages. / Hu, Jianzheng; Yang, Lianqiao; Shin, Moo Whan.

Electronics and Photonics. American Society of Mechanical Engineers (ASME), 2007. p. 251-255 (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); Vol. 5).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Thermal and mechanical analysis of high power leds with ceramic packages

AU - Hu, Jianzheng

AU - Yang, Lianqiao

AU - Shin, Moo Whan

PY - 2007

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N2 - In this paper we present the thermal and mechanical analysis of high power light emitting diodes with ceramic packages. Transient thermal measurements and thermomechanical simulations were performed to study the thermal and mechanical characteristics of ceramic packages. Thermal resistances from the junction to the ambient were decreased from 76.1 °C/W to 45.3 °C/W by replacing the plastic mould to the ceramic mould for LED packages. Higher level of thermomechanical stress in the chip was found for LEDs with ceramic packages despite of less mismatching coefficients of thermal expansion comparing with plastic packages. The results suggest that the thermal performance of LEDs can be improved by using ceramic packages, but the mounting process of the high power LEDs with ceramic packages is critically important and should be in charge of delaminating interface layers in the packages.

AB - In this paper we present the thermal and mechanical analysis of high power light emitting diodes with ceramic packages. Transient thermal measurements and thermomechanical simulations were performed to study the thermal and mechanical characteristics of ceramic packages. Thermal resistances from the junction to the ambient were decreased from 76.1 °C/W to 45.3 °C/W by replacing the plastic mould to the ceramic mould for LED packages. Higher level of thermomechanical stress in the chip was found for LEDs with ceramic packages despite of less mismatching coefficients of thermal expansion comparing with plastic packages. The results suggest that the thermal performance of LEDs can be improved by using ceramic packages, but the mounting process of the high power LEDs with ceramic packages is critically important and should be in charge of delaminating interface layers in the packages.

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BT - Electronics and Photonics

PB - American Society of Mechanical Engineers (ASME)

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ER -

Thermal and mechanical analysis of high power leds with ceramic packages

Abstract

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All Science Journal Classification (ASJC) codes

Access to Document

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