Thermal and mechanical analysis of high power leds with ceramic packages

Jianzheng Hu, Lianqiao Yang, Moo Whan Shin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

In this paper we present the thermal and mechanical analysis of high power light emitting diodes with ceramic packages. Transient thermal measurements and thermomechanical simulations were performed to study the thermal and mechanical characteristics of ceramic packages. Thermal resistances from the junction to the ambient were decreased from 76.1 °C/W to 45.3 °C/W by replacing the plastic mould to the ceramic mould for LED packages. Higher level of thermomechanical stress in the chip was found for LEDs with ceramic packages despite of less mismatching coefficients of thermal expansion comparing with plastic packages. The results suggest that the thermal performance of LEDs can be improved by using ceramic packages, but the mounting process of the high power LEDs with ceramic packages is critically important and should be in charge of delaminating interface layers in the packages.

Original languageEnglish
Title of host publicationElectronics and Photonics
PublisherAmerican Society of Mechanical Engineers (ASME)
Pages251-255
Number of pages5
ISBN (Electronic)0791842991
DOIs
Publication statusPublished - 2007 Jan 1
EventASME 2007 International Mechanical Engineering Congress and Exposition, IMECE 2007 - Seattle, United States
Duration: 2007 Nov 112007 Nov 15

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Volume5

Other

OtherASME 2007 International Mechanical Engineering Congress and Exposition, IMECE 2007
CountryUnited States
CitySeattle
Period07/11/1107/11/15

Fingerprint

Light emitting diodes
Plastic molds
Mountings
Heat resistance
Thermal expansion
Hot Temperature
Plastics

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering

Cite this

Hu, J., Yang, L., & Shin, M. W. (2007). Thermal and mechanical analysis of high power leds with ceramic packages. In Electronics and Photonics (pp. 251-255). (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); Vol. 5). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/IMECE200741759
Hu, Jianzheng ; Yang, Lianqiao ; Shin, Moo Whan. / Thermal and mechanical analysis of high power leds with ceramic packages. Electronics and Photonics. American Society of Mechanical Engineers (ASME), 2007. pp. 251-255 (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)).
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Hu, J, Yang, L & Shin, MW 2007, Thermal and mechanical analysis of high power leds with ceramic packages. in Electronics and Photonics. ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), vol. 5, American Society of Mechanical Engineers (ASME), pp. 251-255, ASME 2007 International Mechanical Engineering Congress and Exposition, IMECE 2007, Seattle, United States, 07/11/11. https://doi.org/10.1115/IMECE200741759

Thermal and mechanical analysis of high power leds with ceramic packages. / Hu, Jianzheng; Yang, Lianqiao; Shin, Moo Whan.

Electronics and Photonics. American Society of Mechanical Engineers (ASME), 2007. p. 251-255 (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); Vol. 5).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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N2 - In this paper we present the thermal and mechanical analysis of high power light emitting diodes with ceramic packages. Transient thermal measurements and thermomechanical simulations were performed to study the thermal and mechanical characteristics of ceramic packages. Thermal resistances from the junction to the ambient were decreased from 76.1 °C/W to 45.3 °C/W by replacing the plastic mould to the ceramic mould for LED packages. Higher level of thermomechanical stress in the chip was found for LEDs with ceramic packages despite of less mismatching coefficients of thermal expansion comparing with plastic packages. The results suggest that the thermal performance of LEDs can be improved by using ceramic packages, but the mounting process of the high power LEDs with ceramic packages is critically important and should be in charge of delaminating interface layers in the packages.

AB - In this paper we present the thermal and mechanical analysis of high power light emitting diodes with ceramic packages. Transient thermal measurements and thermomechanical simulations were performed to study the thermal and mechanical characteristics of ceramic packages. Thermal resistances from the junction to the ambient were decreased from 76.1 °C/W to 45.3 °C/W by replacing the plastic mould to the ceramic mould for LED packages. Higher level of thermomechanical stress in the chip was found for LEDs with ceramic packages despite of less mismatching coefficients of thermal expansion comparing with plastic packages. The results suggest that the thermal performance of LEDs can be improved by using ceramic packages, but the mounting process of the high power LEDs with ceramic packages is critically important and should be in charge of delaminating interface layers in the packages.

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Hu J, Yang L, Shin MW. Thermal and mechanical analysis of high power leds with ceramic packages. In Electronics and Photonics. American Society of Mechanical Engineers (ASME). 2007. p. 251-255. (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)). https://doi.org/10.1115/IMECE200741759