Thermal and mechanical analysis of high-power LEDs with ceramic packages

Jianzheng Hu; Lianqiao Yang; Moo Whan Shin

doi:10.1109/TDMR.2008.920298

Thermal and mechanical analysis of high-power LEDs with ceramic packages

Jianzheng Hu, Lianqiao Yang, Moo Whan Shin

School of Integrated Technology

Research output: Contribution to journal › Article › peer-review

35 Citations (Scopus)

Abstract

In this paper, we present the thermal and mechanical analysis of high-power light-emitting diodes (LEDs) with ceramic packages. Transient thermal measurements and thermomechanical simulations were performed to study the thermal and mechanical characteristics of ceramic packages. Thermal resistances from the junction to the ambient were decreased from 79.6 to 46.7 $^{\circ}\hbox{C/W}$ by replacing the plastic mold with a ceramic mold for LED packages. Thermomechanical stress induced in the heat-block test was simulated using a finite-element method. Higher level of thermomechanical stress in the chip was found for LEDs with ceramic packages, despite less mismatching coefficients of thermal expansion, compared with that with plastic packages. The thermomechanical-stress components in the direction of the thickness were found to be larger than that in other two directions. The results suggest that the thermal performance of LEDs can be improved by using ceramic packages, but the mounting process of the high-power LEDs with ceramic packages is critically important and should be the reason for causing delaminating interface layers in the packages.

Original language	English
Article number	4472167
Pages (from-to)	297-303
Number of pages	7
Journal	IEEE Transactions on Device and Materials Reliability
Volume	8
Issue number	2
DOIs	https://doi.org/10.1109/TDMR.2008.920298
Publication status	Published - 2008 Jun

Bibliographical note

Funding Information:
Mr. Hu received an Excellent Foreign Students Scholarship from the Korea Research Foundation.

Funding Information:
Manuscript received October 11, 2007; revised January 15, 2008. This work was supported by the Korea Energy Management Corporation. The authors are with the Department of Materials Science and Engineering, Myongji University, Yongin 449-728, Korea (e-mail: hoogenzeong@mju.ac.kr; mwshin@mju.ac.kr). Color versions of one or more of the figures in this paper are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/TDMR.2008.920298

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Safety, Risk, Reliability and Quality
Electrical and Electronic Engineering

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10.1109/TDMR.2008.920298

Cite this

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abstract = "In this paper, we present the thermal and mechanical analysis of high-power light-emitting diodes (LEDs) with ceramic packages. Transient thermal measurements and thermomechanical simulations were performed to study the thermal and mechanical characteristics of ceramic packages. Thermal resistances from the junction to the ambient were decreased from 79.6 to 46.7 $^{\circ}\hbox{C/W}$ by replacing the plastic mold with a ceramic mold for LED packages. Thermomechanical stress induced in the heat-block test was simulated using a finite-element method. Higher level of thermomechanical stress in the chip was found for LEDs with ceramic packages, despite less mismatching coefficients of thermal expansion, compared with that with plastic packages. The thermomechanical-stress components in the direction of the thickness were found to be larger than that in other two directions. The results suggest that the thermal performance of LEDs can be improved by using ceramic packages, but the mounting process of the high-power LEDs with ceramic packages is critically important and should be the reason for causing delaminating interface layers in the packages.",

author = "Jianzheng Hu and Lianqiao Yang and Shin, {Moo Whan}",

note = "Funding Information: Mr. Hu received an Excellent Foreign Students Scholarship from the Korea Research Foundation. Funding Information: Manuscript received October 11, 2007; revised January 15, 2008. This work was supported by the Korea Energy Management Corporation. The authors are with the Department of Materials Science and Engineering, Myongji University, Yongin 449-728, Korea (e-mail: hoogenzeong@mju.ac.kr; mwshin@mju.ac.kr). Color versions of one or more of the figures in this paper are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/TDMR.2008.920298",

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N2 - In this paper, we present the thermal and mechanical analysis of high-power light-emitting diodes (LEDs) with ceramic packages. Transient thermal measurements and thermomechanical simulations were performed to study the thermal and mechanical characteristics of ceramic packages. Thermal resistances from the junction to the ambient were decreased from 79.6 to 46.7 $^{\circ}\hbox{C/W}$ by replacing the plastic mold with a ceramic mold for LED packages. Thermomechanical stress induced in the heat-block test was simulated using a finite-element method. Higher level of thermomechanical stress in the chip was found for LEDs with ceramic packages, despite less mismatching coefficients of thermal expansion, compared with that with plastic packages. The thermomechanical-stress components in the direction of the thickness were found to be larger than that in other two directions. The results suggest that the thermal performance of LEDs can be improved by using ceramic packages, but the mounting process of the high-power LEDs with ceramic packages is critically important and should be the reason for causing delaminating interface layers in the packages.

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Thermal and mechanical analysis of high-power LEDs with ceramic packages

Abstract

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