Thermal and mechanical analysis of high-power LEDs with ceramic packages

Jianzheng Hu, Lianqiao Yang, Moo Whan Shin

Research output: Contribution to journalArticle

33 Citations (Scopus)

Abstract

In this paper, we present the thermal and mechanical analysis of high-power light-emitting diodes (LEDs) with ceramic packages. Transient thermal measurements and thermomechanical simulations were performed to study the thermal and mechanical characteristics of ceramic packages. Thermal resistances from the junction to the ambient were decreased from 79.6 to 46.7 $^{\circ}\hbox{C/W}$ by replacing the plastic mold with a ceramic mold for LED packages. Thermomechanical stress induced in the heat-block test was simulated using a finite-element method. Higher level of thermomechanical stress in the chip was found for LEDs with ceramic packages, despite less mismatching coefficients of thermal expansion, compared with that with plastic packages. The thermomechanical-stress components in the direction of the thickness were found to be larger than that in other two directions. The results suggest that the thermal performance of LEDs can be improved by using ceramic packages, but the mounting process of the high-power LEDs with ceramic packages is critically important and should be the reason for causing delaminating interface layers in the packages.

Original languageEnglish
Article number4472167
Pages (from-to)297-303
Number of pages7
JournalIEEE Transactions on Device and Materials Reliability
Volume8
Issue number2
DOIs
Publication statusPublished - 2008 Jun 1

Fingerprint

Light emitting diodes
Plastic molds
Mountings
Heat resistance
Thermal expansion
Hot Temperature
Plastics
Finite element method
Direction compound

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Safety, Risk, Reliability and Quality

Cite this

@article{f97454c44f4e496b9b071818bae52b9e,
title = "Thermal and mechanical analysis of high-power LEDs with ceramic packages",
abstract = "In this paper, we present the thermal and mechanical analysis of high-power light-emitting diodes (LEDs) with ceramic packages. Transient thermal measurements and thermomechanical simulations were performed to study the thermal and mechanical characteristics of ceramic packages. Thermal resistances from the junction to the ambient were decreased from 79.6 to 46.7 $^{\circ}\hbox{C/W}$ by replacing the plastic mold with a ceramic mold for LED packages. Thermomechanical stress induced in the heat-block test was simulated using a finite-element method. Higher level of thermomechanical stress in the chip was found for LEDs with ceramic packages, despite less mismatching coefficients of thermal expansion, compared with that with plastic packages. The thermomechanical-stress components in the direction of the thickness were found to be larger than that in other two directions. The results suggest that the thermal performance of LEDs can be improved by using ceramic packages, but the mounting process of the high-power LEDs with ceramic packages is critically important and should be the reason for causing delaminating interface layers in the packages.",
author = "Jianzheng Hu and Lianqiao Yang and Shin, {Moo Whan}",
year = "2008",
month = "6",
day = "1",
doi = "10.1109/TDMR.2008.920298",
language = "English",
volume = "8",
pages = "297--303",
journal = "IEEE Transactions on Device and Materials Reliability",
issn = "1530-4388",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "2",

}

Thermal and mechanical analysis of high-power LEDs with ceramic packages. / Hu, Jianzheng; Yang, Lianqiao; Shin, Moo Whan.

In: IEEE Transactions on Device and Materials Reliability, Vol. 8, No. 2, 4472167, 01.06.2008, p. 297-303.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Thermal and mechanical analysis of high-power LEDs with ceramic packages

AU - Hu, Jianzheng

AU - Yang, Lianqiao

AU - Shin, Moo Whan

PY - 2008/6/1

Y1 - 2008/6/1

N2 - In this paper, we present the thermal and mechanical analysis of high-power light-emitting diodes (LEDs) with ceramic packages. Transient thermal measurements and thermomechanical simulations were performed to study the thermal and mechanical characteristics of ceramic packages. Thermal resistances from the junction to the ambient were decreased from 79.6 to 46.7 $^{\circ}\hbox{C/W}$ by replacing the plastic mold with a ceramic mold for LED packages. Thermomechanical stress induced in the heat-block test was simulated using a finite-element method. Higher level of thermomechanical stress in the chip was found for LEDs with ceramic packages, despite less mismatching coefficients of thermal expansion, compared with that with plastic packages. The thermomechanical-stress components in the direction of the thickness were found to be larger than that in other two directions. The results suggest that the thermal performance of LEDs can be improved by using ceramic packages, but the mounting process of the high-power LEDs with ceramic packages is critically important and should be the reason for causing delaminating interface layers in the packages.

AB - In this paper, we present the thermal and mechanical analysis of high-power light-emitting diodes (LEDs) with ceramic packages. Transient thermal measurements and thermomechanical simulations were performed to study the thermal and mechanical characteristics of ceramic packages. Thermal resistances from the junction to the ambient were decreased from 79.6 to 46.7 $^{\circ}\hbox{C/W}$ by replacing the plastic mold with a ceramic mold for LED packages. Thermomechanical stress induced in the heat-block test was simulated using a finite-element method. Higher level of thermomechanical stress in the chip was found for LEDs with ceramic packages, despite less mismatching coefficients of thermal expansion, compared with that with plastic packages. The thermomechanical-stress components in the direction of the thickness were found to be larger than that in other two directions. The results suggest that the thermal performance of LEDs can be improved by using ceramic packages, but the mounting process of the high-power LEDs with ceramic packages is critically important and should be the reason for causing delaminating interface layers in the packages.

UR - http://www.scopus.com/inward/record.url?scp=57549117854&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=57549117854&partnerID=8YFLogxK

U2 - 10.1109/TDMR.2008.920298

DO - 10.1109/TDMR.2008.920298

M3 - Article

AN - SCOPUS:57549117854

VL - 8

SP - 297

EP - 303

JO - IEEE Transactions on Device and Materials Reliability

JF - IEEE Transactions on Device and Materials Reliability

SN - 1530-4388

IS - 2

M1 - 4472167

ER -