Abstract
In this paper we present the thermal and mechanical analysis of high power light emitting diodes with ceramic packages. Transient thermal measurements and thermo-mechanical simulations were performed to study the thermal and mechanical characteristics of ceramic packages. Thermal resistances from the junction to the ambient were decreased from 76.1 °CAV to 45.3 °CAV by replacing the plastic mould to the ceramic mould for LED packages. Higher level of thermo-mechanical stress in the chip was found for LEDs with ceramic packages despite of less mismatching coefficients of thermal expansion comparing with plastic packages. The results suggest that the thermal performance of LEDs can be improved by using ceramic packages, but the mounting process of the high power LEDs with ceramic packages is critically important and should be in charge of delaminating interface layers in the packages.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007 |
| Pages | 251-255 |
| Number of pages | 5 |
| Volume | 5 |
| DOIs | |
| Publication status | Published - 2008 May 28 |
| Event | ASME International Mechanical Engineering Congress and Exposition, IMECE 2007 - Seattle, WA, United States Duration: 2007 Nov 11 → 2007 Nov 15 |
Other
| Other | ASME International Mechanical Engineering Congress and Exposition, IMECE 2007 |
|---|---|
| Country | United States |
| City | Seattle, WA |
| Period | 07/11/11 → 07/11/15 |
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All Science Journal Classification (ASJC) codes
- Engineering(all)
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Thermal and mechanical analysis of high power leds with ceramic packages. / Hu, Jianzheng; Yang, Lianqiao; Shin, Moo Whan.
Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007. Vol. 5 2008. p. 251-255.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Thermal and mechanical analysis of high power leds with ceramic packages
AU - Hu, Jianzheng
AU - Yang, Lianqiao
AU - Shin, Moo Whan
PY - 2008/5/28
Y1 - 2008/5/28
N2 - In this paper we present the thermal and mechanical analysis of high power light emitting diodes with ceramic packages. Transient thermal measurements and thermo-mechanical simulations were performed to study the thermal and mechanical characteristics of ceramic packages. Thermal resistances from the junction to the ambient were decreased from 76.1 °CAV to 45.3 °CAV by replacing the plastic mould to the ceramic mould for LED packages. Higher level of thermo-mechanical stress in the chip was found for LEDs with ceramic packages despite of less mismatching coefficients of thermal expansion comparing with plastic packages. The results suggest that the thermal performance of LEDs can be improved by using ceramic packages, but the mounting process of the high power LEDs with ceramic packages is critically important and should be in charge of delaminating interface layers in the packages.
AB - In this paper we present the thermal and mechanical analysis of high power light emitting diodes with ceramic packages. Transient thermal measurements and thermo-mechanical simulations were performed to study the thermal and mechanical characteristics of ceramic packages. Thermal resistances from the junction to the ambient were decreased from 76.1 °CAV to 45.3 °CAV by replacing the plastic mould to the ceramic mould for LED packages. Higher level of thermo-mechanical stress in the chip was found for LEDs with ceramic packages despite of less mismatching coefficients of thermal expansion comparing with plastic packages. The results suggest that the thermal performance of LEDs can be improved by using ceramic packages, but the mounting process of the high power LEDs with ceramic packages is critically important and should be in charge of delaminating interface layers in the packages.
UR - http://www.scopus.com/inward/record.url?scp=44149105642&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=44149105642&partnerID=8YFLogxK
U2 - 10.1115/IMECE2007-41759
DO - 10.1115/IMECE2007-41759
M3 - Conference contribution
AN - SCOPUS:44149105642
SN - 0791842991
SN - 9780791842997
VL - 5
SP - 251
EP - 255
BT - Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007
ER -