Thermal and mechanical analysis of high power leds with ceramic packages

Jianzheng Hu, Lianqiao Yang, Moo Whan Shin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper we present the thermal and mechanical analysis of high power light emitting diodes with ceramic packages. Transient thermal measurements and thermo-mechanical simulations were performed to study the thermal and mechanical characteristics of ceramic packages. Thermal resistances from the junction to the ambient were decreased from 76.1 °CAV to 45.3 °CAV by replacing the plastic mould to the ceramic mould for LED packages. Higher level of thermo-mechanical stress in the chip was found for LEDs with ceramic packages despite of less mismatching coefficients of thermal expansion comparing with plastic packages. The results suggest that the thermal performance of LEDs can be improved by using ceramic packages, but the mounting process of the high power LEDs with ceramic packages is critically important and should be in charge of delaminating interface layers in the packages.

Original languageEnglish
Title of host publicationProceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007
Pages251-255
Number of pages5
Volume5
DOIs
Publication statusPublished - 2008 May 28
EventASME International Mechanical Engineering Congress and Exposition, IMECE 2007 - Seattle, WA, United States
Duration: 2007 Nov 112007 Nov 15

Other

OtherASME International Mechanical Engineering Congress and Exposition, IMECE 2007
CountryUnited States
CitySeattle, WA
Period07/11/1107/11/15

Fingerprint

Light emitting diodes
Plastic molds
Mountings
Heat resistance
Thermal expansion
Hot Temperature
Plastics

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Hu, J., Yang, L., & Shin, M. W. (2008). Thermal and mechanical analysis of high power leds with ceramic packages. In Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007 (Vol. 5, pp. 251-255) https://doi.org/10.1115/IMECE2007-41759
Hu, Jianzheng ; Yang, Lianqiao ; Shin, Moo Whan. / Thermal and mechanical analysis of high power leds with ceramic packages. Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007. Vol. 5 2008. pp. 251-255
@inproceedings{5813ffa53709487183c7b2a1ea6b1d8d,
title = "Thermal and mechanical analysis of high power leds with ceramic packages",
abstract = "In this paper we present the thermal and mechanical analysis of high power light emitting diodes with ceramic packages. Transient thermal measurements and thermo-mechanical simulations were performed to study the thermal and mechanical characteristics of ceramic packages. Thermal resistances from the junction to the ambient were decreased from 76.1 °CAV to 45.3 °CAV by replacing the plastic mould to the ceramic mould for LED packages. Higher level of thermo-mechanical stress in the chip was found for LEDs with ceramic packages despite of less mismatching coefficients of thermal expansion comparing with plastic packages. The results suggest that the thermal performance of LEDs can be improved by using ceramic packages, but the mounting process of the high power LEDs with ceramic packages is critically important and should be in charge of delaminating interface layers in the packages.",
author = "Jianzheng Hu and Lianqiao Yang and Shin, {Moo Whan}",
year = "2008",
month = "5",
day = "28",
doi = "10.1115/IMECE2007-41759",
language = "English",
isbn = "0791842991",
volume = "5",
pages = "251--255",
booktitle = "Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007",

}

Hu, J, Yang, L & Shin, MW 2008, Thermal and mechanical analysis of high power leds with ceramic packages. in Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007. vol. 5, pp. 251-255, ASME International Mechanical Engineering Congress and Exposition, IMECE 2007, Seattle, WA, United States, 07/11/11. https://doi.org/10.1115/IMECE2007-41759

Thermal and mechanical analysis of high power leds with ceramic packages. / Hu, Jianzheng; Yang, Lianqiao; Shin, Moo Whan.

Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007. Vol. 5 2008. p. 251-255.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Thermal and mechanical analysis of high power leds with ceramic packages

AU - Hu, Jianzheng

AU - Yang, Lianqiao

AU - Shin, Moo Whan

PY - 2008/5/28

Y1 - 2008/5/28

N2 - In this paper we present the thermal and mechanical analysis of high power light emitting diodes with ceramic packages. Transient thermal measurements and thermo-mechanical simulations were performed to study the thermal and mechanical characteristics of ceramic packages. Thermal resistances from the junction to the ambient were decreased from 76.1 °CAV to 45.3 °CAV by replacing the plastic mould to the ceramic mould for LED packages. Higher level of thermo-mechanical stress in the chip was found for LEDs with ceramic packages despite of less mismatching coefficients of thermal expansion comparing with plastic packages. The results suggest that the thermal performance of LEDs can be improved by using ceramic packages, but the mounting process of the high power LEDs with ceramic packages is critically important and should be in charge of delaminating interface layers in the packages.

AB - In this paper we present the thermal and mechanical analysis of high power light emitting diodes with ceramic packages. Transient thermal measurements and thermo-mechanical simulations were performed to study the thermal and mechanical characteristics of ceramic packages. Thermal resistances from the junction to the ambient were decreased from 76.1 °CAV to 45.3 °CAV by replacing the plastic mould to the ceramic mould for LED packages. Higher level of thermo-mechanical stress in the chip was found for LEDs with ceramic packages despite of less mismatching coefficients of thermal expansion comparing with plastic packages. The results suggest that the thermal performance of LEDs can be improved by using ceramic packages, but the mounting process of the high power LEDs with ceramic packages is critically important and should be in charge of delaminating interface layers in the packages.

UR - http://www.scopus.com/inward/record.url?scp=44149105642&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=44149105642&partnerID=8YFLogxK

U2 - 10.1115/IMECE2007-41759

DO - 10.1115/IMECE2007-41759

M3 - Conference contribution

AN - SCOPUS:44149105642

SN - 0791842991

SN - 9780791842997

VL - 5

SP - 251

EP - 255

BT - Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007

ER -

Hu J, Yang L, Shin MW. Thermal and mechanical analysis of high power leds with ceramic packages. In Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007. Vol. 5. 2008. p. 251-255 https://doi.org/10.1115/IMECE2007-41759