Thermal and mechanical analysis of high power leds with ceramic packages

Jianzheng Hu, Lianqiao Yang, Moo Whan Shin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper we present the thermal and mechanical analysis of high power light emitting diodes with ceramic packages. Transient thermal measurements and thermo-mechanical simulations were performed to study the thermal and mechanical characteristics of ceramic packages. Thermal resistances from the junction to the ambient were decreased from 76.1 °CAV to 45.3 °CAV by replacing the plastic mould to the ceramic mould for LED packages. Higher level of thermo-mechanical stress in the chip was found for LEDs with ceramic packages despite of less mismatching coefficients of thermal expansion comparing with plastic packages. The results suggest that the thermal performance of LEDs can be improved by using ceramic packages, but the mounting process of the high power LEDs with ceramic packages is critically important and should be in charge of delaminating interface layers in the packages.

Original languageEnglish
Title of host publicationProceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007
Pages251-255
Number of pages5
Volume5
DOIs
Publication statusPublished - 2008 May 28
EventASME International Mechanical Engineering Congress and Exposition, IMECE 2007 - Seattle, WA, United States
Duration: 2007 Nov 112007 Nov 15

Other

OtherASME International Mechanical Engineering Congress and Exposition, IMECE 2007
CountryUnited States
CitySeattle, WA
Period07/11/1107/11/15

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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  • Cite this

    Hu, J., Yang, L., & Shin, M. W. (2008). Thermal and mechanical analysis of high power leds with ceramic packages. In Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007 (Vol. 5, pp. 251-255) https://doi.org/10.1115/IMECE2007-41759