Thermal and optical performance of a light-emitting-diode metal package with an integrated reflector and heat spreader structure

Jin Hwan Kim, Jong Hwa Choi, Moo Whan Shin

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

We develop a light-emitting diode (LED) metal package consisting of a reflector integrated with a heat spreader as one body. The structure functions obtained from the thermal transient measurement reveals that the integrated structure of the metal package leads to improved thermal performance. We make significant efforts to clarify the interaction between the extracted light from the LED chip and the inside surface of the metal package. The radiant flux from the LED chip is calculated from the definition of thermal resistance and is implemented as an input parameter to predict the optical power and ray tracing. The simulated optical output power in the far-field mode is 145. 3$~$mW, which is in good agreement with the value measured by an integrating sphere. It is shown that a large portion of the emitted light (37.12 mW) is lost by the interaction with the package surface before it reaches the far-field receiver. It is demonstrated that the angle of the first reflector cup is one of the critical design parameters in the metal package structure that we investigate. When the first reflector angle is optimized from 80° to 55° (with the second reflector angle of 50°), the optical power increases from its original value of 145.3-170.15 mW with an improved optical extraction efficiency from 75.63% to 88.57%. The ray tracing and illuminance raster charts also confirm that the improved optical performance of the metal package mainly stems from the optimization of the reflector angles.

Original languageEnglish
Article number6570527
Pages (from-to)794-799
Number of pages6
JournalIEEE/OSA Journal of Display Technology
Volume9
Issue number10
DOIs
Publication statusPublished - 2013 Oct 25

Fingerprint

Spreaders
reflectors
Light emitting diodes
light emitting diodes
Metals
heat
metals
Ray tracing
ray tracing
far fields
chips
illuminance
Heat resistance
charts
thermal resistance
tracing
stems
Hot Temperature
Fluxes
receivers

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

@article{9e983e7a6bc54c5a9a2dccafe749971f,
title = "Thermal and optical performance of a light-emitting-diode metal package with an integrated reflector and heat spreader structure",
abstract = "We develop a light-emitting diode (LED) metal package consisting of a reflector integrated with a heat spreader as one body. The structure functions obtained from the thermal transient measurement reveals that the integrated structure of the metal package leads to improved thermal performance. We make significant efforts to clarify the interaction between the extracted light from the LED chip and the inside surface of the metal package. The radiant flux from the LED chip is calculated from the definition of thermal resistance and is implemented as an input parameter to predict the optical power and ray tracing. The simulated optical output power in the far-field mode is 145. 3$~$mW, which is in good agreement with the value measured by an integrating sphere. It is shown that a large portion of the emitted light (37.12 mW) is lost by the interaction with the package surface before it reaches the far-field receiver. It is demonstrated that the angle of the first reflector cup is one of the critical design parameters in the metal package structure that we investigate. When the first reflector angle is optimized from 80° to 55° (with the second reflector angle of 50°), the optical power increases from its original value of 145.3-170.15 mW with an improved optical extraction efficiency from 75.63{\%} to 88.57{\%}. The ray tracing and illuminance raster charts also confirm that the improved optical performance of the metal package mainly stems from the optimization of the reflector angles.",
author = "Kim, {Jin Hwan} and Choi, {Jong Hwa} and Shin, {Moo Whan}",
year = "2013",
month = "10",
day = "25",
doi = "10.1109/JDT.2013.2274591",
language = "English",
volume = "9",
pages = "794--799",
journal = "IEEE/OSA Journal of Display Technology",
issn = "1551-319X",
publisher = "IEEE Computer Society",
number = "10",

}

Thermal and optical performance of a light-emitting-diode metal package with an integrated reflector and heat spreader structure. / Kim, Jin Hwan; Choi, Jong Hwa; Shin, Moo Whan.

In: IEEE/OSA Journal of Display Technology, Vol. 9, No. 10, 6570527, 25.10.2013, p. 794-799.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Thermal and optical performance of a light-emitting-diode metal package with an integrated reflector and heat spreader structure

AU - Kim, Jin Hwan

AU - Choi, Jong Hwa

AU - Shin, Moo Whan

PY - 2013/10/25

Y1 - 2013/10/25

N2 - We develop a light-emitting diode (LED) metal package consisting of a reflector integrated with a heat spreader as one body. The structure functions obtained from the thermal transient measurement reveals that the integrated structure of the metal package leads to improved thermal performance. We make significant efforts to clarify the interaction between the extracted light from the LED chip and the inside surface of the metal package. The radiant flux from the LED chip is calculated from the definition of thermal resistance and is implemented as an input parameter to predict the optical power and ray tracing. The simulated optical output power in the far-field mode is 145. 3$~$mW, which is in good agreement with the value measured by an integrating sphere. It is shown that a large portion of the emitted light (37.12 mW) is lost by the interaction with the package surface before it reaches the far-field receiver. It is demonstrated that the angle of the first reflector cup is one of the critical design parameters in the metal package structure that we investigate. When the first reflector angle is optimized from 80° to 55° (with the second reflector angle of 50°), the optical power increases from its original value of 145.3-170.15 mW with an improved optical extraction efficiency from 75.63% to 88.57%. The ray tracing and illuminance raster charts also confirm that the improved optical performance of the metal package mainly stems from the optimization of the reflector angles.

AB - We develop a light-emitting diode (LED) metal package consisting of a reflector integrated with a heat spreader as one body. The structure functions obtained from the thermal transient measurement reveals that the integrated structure of the metal package leads to improved thermal performance. We make significant efforts to clarify the interaction between the extracted light from the LED chip and the inside surface of the metal package. The radiant flux from the LED chip is calculated from the definition of thermal resistance and is implemented as an input parameter to predict the optical power and ray tracing. The simulated optical output power in the far-field mode is 145. 3$~$mW, which is in good agreement with the value measured by an integrating sphere. It is shown that a large portion of the emitted light (37.12 mW) is lost by the interaction with the package surface before it reaches the far-field receiver. It is demonstrated that the angle of the first reflector cup is one of the critical design parameters in the metal package structure that we investigate. When the first reflector angle is optimized from 80° to 55° (with the second reflector angle of 50°), the optical power increases from its original value of 145.3-170.15 mW with an improved optical extraction efficiency from 75.63% to 88.57%. The ray tracing and illuminance raster charts also confirm that the improved optical performance of the metal package mainly stems from the optimization of the reflector angles.

UR - http://www.scopus.com/inward/record.url?scp=84886876209&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84886876209&partnerID=8YFLogxK

U2 - 10.1109/JDT.2013.2274591

DO - 10.1109/JDT.2013.2274591

M3 - Article

VL - 9

SP - 794

EP - 799

JO - IEEE/OSA Journal of Display Technology

JF - IEEE/OSA Journal of Display Technology

SN - 1551-319X

IS - 10

M1 - 6570527

ER -