Thermal annealing effects on the atomic layer deposited LaAlO3 thin films on Si substrate

Dail Eom, Cheol Seong Hwang, Hyeong Joon Kim, Mann Ho Cho, K. B. Chung

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20 Citations (Scopus)


The changes in film structure of amorphous atomic layer deposited LaAlO3 thin films after thermal annealing were examined by medium-energy ion-scattering measurements and angle-resolved X-ray photoelectron spectroscopy. Thermal annealing induces Si-rich LaSiO and Al-deficient LaAlx Siy Oz layers on a few monolayers of SiO2. Al atoms do not participate in silicate formation during annealing. Instead, they migrate toward the film surface, which induces nonhomogeneity in the films along the vertical direction. The concentrations of Al and La on the film surface increase and decrease, respectively, as a result of Si diffusion from the substrate and silicate formation.

Original languageEnglish
Pages (from-to)G33-G36
JournalElectrochemical and Solid-State Letters
Issue number7
Publication statusPublished - 2008

All Science Journal Classification (ASJC) codes

  • Chemical Engineering(all)
  • Materials Science(all)
  • Physical and Theoretical Chemistry
  • Electrochemistry
  • Electrical and Electronic Engineering


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