Although the near threshold voltage (NTV) design has achieved energy efficiency, certain challenges remain regarding its application. In this paper, we describe the analysis of thermally induced reliability concern in test process. In an NTV environment, the thermal dependency of a circuit delay is changed, and a difference in thermal constraints from that in a nominal voltage design exists. In addition, we propose a new test scheduling method for NTV circuits that alleviates the thermal constraints in system-on-chip test processes. Our simulation results show that the test time could be reduced while minimizing the reliability loss.
|Number of pages||5|
|Journal||IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems|
|Publication status||Published - 2018 Apr|
All Science Journal Classification (ASJC) codes
- Computer Graphics and Computer-Aided Design
- Electrical and Electronic Engineering