Thermal behavior of direct-printed lines of silver nanoparticles

jin woo Park, Seong Gu Baek

Research output: Contribution to journalArticle

74 Citations (Scopus)

Abstract

We studied the thermal behavior of direct-printed conductive lines of Ag nanoparticles that were sintered at various times and temperatures. Transmission electron microscopy and an optical profiler were used to analyze the effect of sintering temperature and time on the shape and microstructure evolution of the lines. The measurement results showed that, when sintered at higher temperatures, the structure became denser with grain growth; however, significant central collapse of the lines and large interagglomerate pores increased electrical resistivity.

Original languageEnglish
Pages (from-to)1139-1142
Number of pages4
JournalScripta Materialia
Volume55
Issue number12
DOIs
Publication statusPublished - 2006 Dec 1

Fingerprint

Silver
silver
Nanoparticles
nanoparticles
sintering
porosity
Grain growth
Temperature
transmission electron microscopy
microstructure
electrical resistivity
temperature
Sintering
Transmission electron microscopy
Microstructure
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Materials Science(all)
  • Metals and Alloys

Cite this

Park, jin woo ; Baek, Seong Gu. / Thermal behavior of direct-printed lines of silver nanoparticles. In: Scripta Materialia. 2006 ; Vol. 55, No. 12. pp. 1139-1142.
@article{c8e18c0374634da1b6ea51ff69e9ebb0,
title = "Thermal behavior of direct-printed lines of silver nanoparticles",
abstract = "We studied the thermal behavior of direct-printed conductive lines of Ag nanoparticles that were sintered at various times and temperatures. Transmission electron microscopy and an optical profiler were used to analyze the effect of sintering temperature and time on the shape and microstructure evolution of the lines. The measurement results showed that, when sintered at higher temperatures, the structure became denser with grain growth; however, significant central collapse of the lines and large interagglomerate pores increased electrical resistivity.",
author = "Park, {jin woo} and Baek, {Seong Gu}",
year = "2006",
month = "12",
day = "1",
doi = "10.1016/j.scriptamat.2006.08.032",
language = "English",
volume = "55",
pages = "1139--1142",
journal = "Scripta Materialia",
issn = "1359-6462",
publisher = "Elsevier Limited",
number = "12",

}

Thermal behavior of direct-printed lines of silver nanoparticles. / Park, jin woo; Baek, Seong Gu.

In: Scripta Materialia, Vol. 55, No. 12, 01.12.2006, p. 1139-1142.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Thermal behavior of direct-printed lines of silver nanoparticles

AU - Park, jin woo

AU - Baek, Seong Gu

PY - 2006/12/1

Y1 - 2006/12/1

N2 - We studied the thermal behavior of direct-printed conductive lines of Ag nanoparticles that were sintered at various times and temperatures. Transmission electron microscopy and an optical profiler were used to analyze the effect of sintering temperature and time on the shape and microstructure evolution of the lines. The measurement results showed that, when sintered at higher temperatures, the structure became denser with grain growth; however, significant central collapse of the lines and large interagglomerate pores increased electrical resistivity.

AB - We studied the thermal behavior of direct-printed conductive lines of Ag nanoparticles that were sintered at various times and temperatures. Transmission electron microscopy and an optical profiler were used to analyze the effect of sintering temperature and time on the shape and microstructure evolution of the lines. The measurement results showed that, when sintered at higher temperatures, the structure became denser with grain growth; however, significant central collapse of the lines and large interagglomerate pores increased electrical resistivity.

UR - http://www.scopus.com/inward/record.url?scp=33749533484&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33749533484&partnerID=8YFLogxK

U2 - 10.1016/j.scriptamat.2006.08.032

DO - 10.1016/j.scriptamat.2006.08.032

M3 - Article

VL - 55

SP - 1139

EP - 1142

JO - Scripta Materialia

JF - Scripta Materialia

SN - 1359-6462

IS - 12

ER -