Thermal Behavior of Remote Phosphor in Light-Emitting Diode Packages

J. H. Kim, M. W. Shin

Research output: Contribution to journalArticle

15 Citations (Scopus)

Abstract

This letter reports on the detailed thermal behavior of remote type light-emitting diode (LED) packages with different positions of a phosphor layer from the substrate. The temperatures of phosphor layers were directly measured using microthermocouples. It was confirmed by both measurement and simulation, for the investigated LED package structure, the phosphor temperatures are always higher than the junction temperature. Both temperatures are found to change as a function of the phosphor-substrate distance. It is demonstrated that the distance determines the effect of back-scattered photons and the thermal resistance between the phosphor layer and the substrate. From both the experiment and simulation results, it is proposed that there exists an optimal distance of phosphor layer in the remote-type LED package, which is about 320 μ m for the package structure utilized in this study. The package with the optimal position exhibits an optical output which is 6% higher than that from a package where the phosphor layer directly covers LED chip. It is shown that the heating load at the phosphor layer changes with the position of the phosphor layer and must be implemented for the precise thermal analysis of whole LED package.

Original languageEnglish
Article number7150353
Pages (from-to)832-834
Number of pages3
JournalIEEE Electron Device Letters
Volume36
Issue number8
DOIs
Publication statusPublished - 2015 Aug 1

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Phosphors
Light emitting diodes
Substrates
Hot Temperature
Temperature
Heat resistance
Thermoanalysis
Photons
Heating

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

@article{720fc9d5a1124444b0c6b72e5b1f7b8d,
title = "Thermal Behavior of Remote Phosphor in Light-Emitting Diode Packages",
abstract = "This letter reports on the detailed thermal behavior of remote type light-emitting diode (LED) packages with different positions of a phosphor layer from the substrate. The temperatures of phosphor layers were directly measured using microthermocouples. It was confirmed by both measurement and simulation, for the investigated LED package structure, the phosphor temperatures are always higher than the junction temperature. Both temperatures are found to change as a function of the phosphor-substrate distance. It is demonstrated that the distance determines the effect of back-scattered photons and the thermal resistance between the phosphor layer and the substrate. From both the experiment and simulation results, it is proposed that there exists an optimal distance of phosphor layer in the remote-type LED package, which is about 320 μ m for the package structure utilized in this study. The package with the optimal position exhibits an optical output which is 6{\%} higher than that from a package where the phosphor layer directly covers LED chip. It is shown that the heating load at the phosphor layer changes with the position of the phosphor layer and must be implemented for the precise thermal analysis of whole LED package.",
author = "Kim, {J. H.} and Shin, {M. W.}",
year = "2015",
month = "8",
day = "1",
doi = "10.1109/LED.2015.2441139",
language = "English",
volume = "36",
pages = "832--834",
journal = "IEEE Electron Device Letters",
issn = "0741-3106",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "8",

}

Thermal Behavior of Remote Phosphor in Light-Emitting Diode Packages. / Kim, J. H.; Shin, M. W.

In: IEEE Electron Device Letters, Vol. 36, No. 8, 7150353, 01.08.2015, p. 832-834.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Thermal Behavior of Remote Phosphor in Light-Emitting Diode Packages

AU - Kim, J. H.

AU - Shin, M. W.

PY - 2015/8/1

Y1 - 2015/8/1

N2 - This letter reports on the detailed thermal behavior of remote type light-emitting diode (LED) packages with different positions of a phosphor layer from the substrate. The temperatures of phosphor layers were directly measured using microthermocouples. It was confirmed by both measurement and simulation, for the investigated LED package structure, the phosphor temperatures are always higher than the junction temperature. Both temperatures are found to change as a function of the phosphor-substrate distance. It is demonstrated that the distance determines the effect of back-scattered photons and the thermal resistance between the phosphor layer and the substrate. From both the experiment and simulation results, it is proposed that there exists an optimal distance of phosphor layer in the remote-type LED package, which is about 320 μ m for the package structure utilized in this study. The package with the optimal position exhibits an optical output which is 6% higher than that from a package where the phosphor layer directly covers LED chip. It is shown that the heating load at the phosphor layer changes with the position of the phosphor layer and must be implemented for the precise thermal analysis of whole LED package.

AB - This letter reports on the detailed thermal behavior of remote type light-emitting diode (LED) packages with different positions of a phosphor layer from the substrate. The temperatures of phosphor layers were directly measured using microthermocouples. It was confirmed by both measurement and simulation, for the investigated LED package structure, the phosphor temperatures are always higher than the junction temperature. Both temperatures are found to change as a function of the phosphor-substrate distance. It is demonstrated that the distance determines the effect of back-scattered photons and the thermal resistance between the phosphor layer and the substrate. From both the experiment and simulation results, it is proposed that there exists an optimal distance of phosphor layer in the remote-type LED package, which is about 320 μ m for the package structure utilized in this study. The package with the optimal position exhibits an optical output which is 6% higher than that from a package where the phosphor layer directly covers LED chip. It is shown that the heating load at the phosphor layer changes with the position of the phosphor layer and must be implemented for the precise thermal analysis of whole LED package.

UR - http://www.scopus.com/inward/record.url?scp=84937937707&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84937937707&partnerID=8YFLogxK

U2 - 10.1109/LED.2015.2441139

DO - 10.1109/LED.2015.2441139

M3 - Article

VL - 36

SP - 832

EP - 834

JO - IEEE Electron Device Letters

JF - IEEE Electron Device Letters

SN - 0741-3106

IS - 8

M1 - 7150353

ER -