Thermal bridge and heat transfer analysis for each part in residential building according to construction of wood-based finishing material

Jungki Seo, Su Gwang Jeong, Sumin Kim

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

Many researches and policies have been carried out for saving energy in buildings. However, there are a few studies of thermal characteristics of wood-based materials that have been widely used as structural materials and finishing materials in buildings. In this study, thermal bridging areas were found to investigate thermal performance of residential building using non wood-based materials and wood-based materials. And heat transfer analysis of 16 case studies according to composition of structural materials and finishing materials was conducted. Also in this experiment, Physibel Trisco was used as the heat transfer analysis simulation tool, which conforms to the calculation method of ISO 10211. Analytical modeling was also carried out according to the ISO 10211, and the boundary temperature conditions were set at room temperature 20°C and outdoor temperature -11.3°C (Seoul standard) according to the energy saving design standard in South Korea. Applied structures are classified according to the cases of concrete structure with non wood-based finishing materials, concrete structure with wood-based finishing materials and wood structure. Analyzed building elements were divided into a wall, a roof, an interlayer floor and a bottom floor. As a result, it can be confirmed that the thermal bridge of the concrete structure and wood structure were caused by the geometrical and material causes. In addition, the structural thermal bridge was caused in the discontinuity of the insulation in the concrete structure. Also it was confirmed that the linear heat transfer coefficient of the wall decreases when the wood-based materials are applied to the concrete structure.

Original languageEnglish
Pages (from-to)343-359
Number of pages17
JournalJournal of the Korean Wood Science and Technology
Volume45
Issue number3
DOIs
Publication statusPublished - 2017 Jan 1

    Fingerprint

All Science Journal Classification (ASJC) codes

  • Materials Science (miscellaneous)
  • Industrial and Manufacturing Engineering

Cite this