Thermal conductivity behaviour of silicon carbide Fiber/Phenolic resin composites by the introduction of graphene nanoplatelets

Tae Eon Kim, Jin Chul Bae, Kwang Youn Cho, Yong-Gun Shul, Doh Hyung Riu

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

Silicon carbide (SiC) represents many unique properties, such as high strength, corrosion resistance, high thermal conductivity and high temperature stability. In recent years, the SiC fibers have been widely studied for use as a fillers in polymer-matrix composite materials due to these characteristics. In order to improve the properties of such polymer-matrix composite materials dramatically, the use of graphene as an additive has been investigated both academically and industrially, as it can induce synergetic effect in the polymer-matrix composite materials, including thermoplastic and thermoset composite. In this study, we fabricated highly thermally conductive composites using Tyranno®-SA3 SiC fibers and a phenolic resin. Graphene nanoplatelets were added to composites to improve their thermal conduction properties. Thermal conductivity measurements indicated that in case of the graphene-free composites, thermal conductivity was the highest (4.1 W/m·K) when the filler was added in an amount of 50 vol %, due to the resulting structure formed by filler and matrix being closed-packed. The thermal conductivity and thermal diffusivity measurements of the graphene- nanoplatelets-containing composites showed that addition of the graphene nanoplatelets increased the thermal conductivity values of the composites. In case of the composite containing 50 vol % filler, the thermal conductivity increased to 5.5 W/m·K. This increase was due to a synergetic effect between the SiC filler and the binder induced by the graphene nanoplatelets.

Original languageEnglish
Pages (from-to)5625-5630
Number of pages6
JournalAsian Journal of Chemistry
Volume25
Issue number10
Publication statusPublished - 2013 Jul 17

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Thermal conductivity
Fibers
Composite materials
Fillers
Polymer matrix composites
phenol-formaldehyde resin
silicon carbide
Thermal diffusivity
Thermosets
Thermoplastics
Binders
Corrosion resistance

All Science Journal Classification (ASJC) codes

  • Chemistry(all)

Cite this

@article{21fad4bd8c134baabd9c52877680f0bf,
title = "Thermal conductivity behaviour of silicon carbide Fiber/Phenolic resin composites by the introduction of graphene nanoplatelets",
abstract = "Silicon carbide (SiC) represents many unique properties, such as high strength, corrosion resistance, high thermal conductivity and high temperature stability. In recent years, the SiC fibers have been widely studied for use as a fillers in polymer-matrix composite materials due to these characteristics. In order to improve the properties of such polymer-matrix composite materials dramatically, the use of graphene as an additive has been investigated both academically and industrially, as it can induce synergetic effect in the polymer-matrix composite materials, including thermoplastic and thermoset composite. In this study, we fabricated highly thermally conductive composites using Tyranno{\circledR}-SA3 SiC fibers and a phenolic resin. Graphene nanoplatelets were added to composites to improve their thermal conduction properties. Thermal conductivity measurements indicated that in case of the graphene-free composites, thermal conductivity was the highest (4.1 W/m·K) when the filler was added in an amount of 50 vol {\%}, due to the resulting structure formed by filler and matrix being closed-packed. The thermal conductivity and thermal diffusivity measurements of the graphene- nanoplatelets-containing composites showed that addition of the graphene nanoplatelets increased the thermal conductivity values of the composites. In case of the composite containing 50 vol {\%} filler, the thermal conductivity increased to 5.5 W/m·K. This increase was due to a synergetic effect between the SiC filler and the binder induced by the graphene nanoplatelets.",
author = "Kim, {Tae Eon} and Bae, {Jin Chul} and Cho, {Kwang Youn} and Yong-Gun Shul and Riu, {Doh Hyung}",
year = "2013",
month = "7",
day = "17",
language = "English",
volume = "25",
pages = "5625--5630",
journal = "Asian Journal of Chemistry",
issn = "0970-7077",
publisher = "Chemical Publishing Co.",
number = "10",

}

Thermal conductivity behaviour of silicon carbide Fiber/Phenolic resin composites by the introduction of graphene nanoplatelets. / Kim, Tae Eon; Bae, Jin Chul; Cho, Kwang Youn; Shul, Yong-Gun; Riu, Doh Hyung.

In: Asian Journal of Chemistry, Vol. 25, No. 10, 17.07.2013, p. 5625-5630.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Thermal conductivity behaviour of silicon carbide Fiber/Phenolic resin composites by the introduction of graphene nanoplatelets

AU - Kim, Tae Eon

AU - Bae, Jin Chul

AU - Cho, Kwang Youn

AU - Shul, Yong-Gun

AU - Riu, Doh Hyung

PY - 2013/7/17

Y1 - 2013/7/17

N2 - Silicon carbide (SiC) represents many unique properties, such as high strength, corrosion resistance, high thermal conductivity and high temperature stability. In recent years, the SiC fibers have been widely studied for use as a fillers in polymer-matrix composite materials due to these characteristics. In order to improve the properties of such polymer-matrix composite materials dramatically, the use of graphene as an additive has been investigated both academically and industrially, as it can induce synergetic effect in the polymer-matrix composite materials, including thermoplastic and thermoset composite. In this study, we fabricated highly thermally conductive composites using Tyranno®-SA3 SiC fibers and a phenolic resin. Graphene nanoplatelets were added to composites to improve their thermal conduction properties. Thermal conductivity measurements indicated that in case of the graphene-free composites, thermal conductivity was the highest (4.1 W/m·K) when the filler was added in an amount of 50 vol %, due to the resulting structure formed by filler and matrix being closed-packed. The thermal conductivity and thermal diffusivity measurements of the graphene- nanoplatelets-containing composites showed that addition of the graphene nanoplatelets increased the thermal conductivity values of the composites. In case of the composite containing 50 vol % filler, the thermal conductivity increased to 5.5 W/m·K. This increase was due to a synergetic effect between the SiC filler and the binder induced by the graphene nanoplatelets.

AB - Silicon carbide (SiC) represents many unique properties, such as high strength, corrosion resistance, high thermal conductivity and high temperature stability. In recent years, the SiC fibers have been widely studied for use as a fillers in polymer-matrix composite materials due to these characteristics. In order to improve the properties of such polymer-matrix composite materials dramatically, the use of graphene as an additive has been investigated both academically and industrially, as it can induce synergetic effect in the polymer-matrix composite materials, including thermoplastic and thermoset composite. In this study, we fabricated highly thermally conductive composites using Tyranno®-SA3 SiC fibers and a phenolic resin. Graphene nanoplatelets were added to composites to improve their thermal conduction properties. Thermal conductivity measurements indicated that in case of the graphene-free composites, thermal conductivity was the highest (4.1 W/m·K) when the filler was added in an amount of 50 vol %, due to the resulting structure formed by filler and matrix being closed-packed. The thermal conductivity and thermal diffusivity measurements of the graphene- nanoplatelets-containing composites showed that addition of the graphene nanoplatelets increased the thermal conductivity values of the composites. In case of the composite containing 50 vol % filler, the thermal conductivity increased to 5.5 W/m·K. This increase was due to a synergetic effect between the SiC filler and the binder induced by the graphene nanoplatelets.

UR - http://www.scopus.com/inward/record.url?scp=84880074243&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84880074243&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:84880074243

VL - 25

SP - 5625

EP - 5630

JO - Asian Journal of Chemistry

JF - Asian Journal of Chemistry

SN - 0970-7077

IS - 10

ER -