Thermal conductivity model for Polymer/Boron Nitride nanocomposite considering air void content

Soo Yeol Park, Jin Hwan Kim, Moo Whan Shin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, we considered air void as the key parameter to improve thermal conductivity prediction model. Influences of air void on thermal conductivity of Polymer/BN nanocomposite was investigated by FEM based simulation. Thermal conductivity of composite was decreased with increase of air void content. In case of BN filler with 10 percent of volume fraction and thin layer air void model, thermal conductivity was decreased about 12 percent when we add air void with 1 percent of void content. Position and distribution of air void also influenced thermal conuductivity of nanocomposite. Thermal conductivity of nanocomposite decreased with an increase of contact surface area between air void and filler particle. For verifying these simulation results, we made Polymer/BN nanocomposite samples and analyzed their air void content by applying BET method and thermal conductivity by laser flash method. Influence of content and position of air void is not neglectable especially when the rate of formation of air void is high or air void formed between filler and matrix in the process of composite fabrication. If the parameters related to air void considered in thermal conductivity prediction model, prediciton model will be improved.

Original languageEnglish
Title of host publicationNSTI
Subtitle of host publicationAdvanced Materials - TechConnect Briefs 2015
EditorsBart Romanowicz, Matthew Laudon
PublisherTaylor and Francis Inc.
Pages372-375
Number of pages4
ISBN (Electronic)9781498747271
Publication statusPublished - 2015 Jan 1
Event10th Annual TechConnect World Innovation Conference and Expo, Held Jointly with the 18th Annual Nanotech Conference and Expo, and the 2015 National SBIR/STTR Conference - Washington, United States
Duration: 2015 Jun 142015 Jun 17

Publication series

NameNSTI: Advanced Materials - TechConnect Briefs 2015
Volume1

Other

Other10th Annual TechConnect World Innovation Conference and Expo, Held Jointly with the 18th Annual Nanotech Conference and Expo, and the 2015 National SBIR/STTR Conference
CountryUnited States
CityWashington
Period15/6/1415/6/17

All Science Journal Classification (ASJC) codes

  • Surfaces, Coatings and Films
  • Fluid Flow and Transfer Processes
  • Biotechnology
  • Fuel Technology

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    Park, S. Y., Kim, J. H., & Shin, M. W. (2015). Thermal conductivity model for Polymer/Boron Nitride nanocomposite considering air void content. In B. Romanowicz, & M. Laudon (Eds.), NSTI: Advanced Materials - TechConnect Briefs 2015 (pp. 372-375). (NSTI: Advanced Materials - TechConnect Briefs 2015; Vol. 1). Taylor and Francis Inc..