Thermal decomposition of silver acetate in silver paste for solar cell metallization: An effective route to reduce contact resistance

Suk Jun Kim, Se Yun Kim, Jin Man Park, Keum Hwan Park, Jun Ho Lee, Sang Mock Lee, In Taek Han, Do Hyang Kim, Ka Ram Lim, Won Tae Kim, Ju Cheol Park, Sang Soo Jee, Eun Sung Lee

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Abstract

A screen printed silver/metallic glass (MG) paste formulated with Ag acetate resulted in a specific contact resistance in the range of 0.6-0.7 mΩ·cm2 on both the n- and p-type Si emitters of interdigitated back-contact solar cells. Silver nanocrystallites resulting from thermally decomposed Ag acetate prevented the Al MG frits from directly interacting with the Si emitter, thus reducing the amount of Al diffused into the Si emitters, and subsequently, the contact resistance. A photovoltaic conversion efficiency of 20.3% was achieved using this technique.

Original languageEnglish
Article number063903
JournalApplied Physics Letters
Volume103
Issue number6
DOIs
Publication statusPublished - 2013 Aug 5

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy (miscellaneous)

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    Jun Kim, S., Yun Kim, S., Man Park, J., Hwan Park, K., Ho Lee, J., Mock Lee, S., Taek Han, I., Hyang Kim, D., Ram Lim, K., Tae Kim, W., Cheol Park, J., Soo Jee, S., & Lee, E. S. (2013). Thermal decomposition of silver acetate in silver paste for solar cell metallization: An effective route to reduce contact resistance. Applied Physics Letters, 103(6), [063903]. https://doi.org/10.1063/1.4818124