Thermal design of ceramic packages for high power light-emitting diodes

Lianqiao Yang; Jianzheng Hu; Sunho Jang; Moo Whan Shin

doi:10.1088/0268-1242/22/7/005

Thermal design of ceramic packages for high power light-emitting diodes

Lianqiao Yang, Jianzheng Hu, Sunho Jang, Moo Whan Shin

School of Integrated Technology

Research output: Contribution to journal › Article › peer-review

19 Citations (Scopus)

Abstract

Ceramic packages with different paths of thermal dissipation were designed by a simulation using the finite-volume method. Thermal resistances of the packages were obtained from the calculation of temperatures of LED (light emitting diode) chips. It was shown that the thermal characteristics of LED packages were strongly affected by the contact area of a thermal via in contact with a LED chip rather than that in contact with a ceramic mould. Ceramic LED packages were fabricated and characterized. A deviation of simulated results from experimental results was found. The difference was attributed to the poor contact roughness between the LED chip and the thermal via.

Original language	English
Article number	005
Pages (from-to)	705-708
Number of pages	4
Journal	Semiconductor Science and Technology
Volume	22
Issue number	7
DOIs	https://doi.org/10.1088/0268-1242/22/7/005
Publication status	Published - 2007 Jul 1

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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10.1088/0268-1242/22/7/005

Cite this

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abstract = "Ceramic packages with different paths of thermal dissipation were designed by a simulation using the finite-volume method. Thermal resistances of the packages were obtained from the calculation of temperatures of LED (light emitting diode) chips. It was shown that the thermal characteristics of LED packages were strongly affected by the contact area of a thermal via in contact with a LED chip rather than that in contact with a ceramic mould. Ceramic LED packages were fabricated and characterized. A deviation of simulated results from experimental results was found. The difference was attributed to the poor contact roughness between the LED chip and the thermal via.",

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N2 - Ceramic packages with different paths of thermal dissipation were designed by a simulation using the finite-volume method. Thermal resistances of the packages were obtained from the calculation of temperatures of LED (light emitting diode) chips. It was shown that the thermal characteristics of LED packages were strongly affected by the contact area of a thermal via in contact with a LED chip rather than that in contact with a ceramic mould. Ceramic LED packages were fabricated and characterized. A deviation of simulated results from experimental results was found. The difference was attributed to the poor contact roughness between the LED chip and the thermal via.

AB - Ceramic packages with different paths of thermal dissipation were designed by a simulation using the finite-volume method. Thermal resistances of the packages were obtained from the calculation of temperatures of LED (light emitting diode) chips. It was shown that the thermal characteristics of LED packages were strongly affected by the contact area of a thermal via in contact with a LED chip rather than that in contact with a ceramic mould. Ceramic LED packages were fabricated and characterized. A deviation of simulated results from experimental results was found. The difference was attributed to the poor contact roughness between the LED chip and the thermal via.

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Thermal design of ceramic packages for high power light-emitting diodes

Abstract

All Science Journal Classification (ASJC) codes

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