Thermal design of ceramic packages for high power light-emitting diodes

Lianqiao Yang, Jianzheng Hu, Sunho Jang, Moo Whan Shin

Research output: Contribution to journalArticle

19 Citations (Scopus)

Abstract

Ceramic packages with different paths of thermal dissipation were designed by a simulation using the finite-volume method. Thermal resistances of the packages were obtained from the calculation of temperatures of LED (light emitting diode) chips. It was shown that the thermal characteristics of LED packages were strongly affected by the contact area of a thermal via in contact with a LED chip rather than that in contact with a ceramic mould. Ceramic LED packages were fabricated and characterized. A deviation of simulated results from experimental results was found. The difference was attributed to the poor contact roughness between the LED chip and the thermal via.

Original languageEnglish
Article number005
Pages (from-to)705-708
Number of pages4
JournalSemiconductor Science and Technology
Volume22
Issue number7
DOIs
Publication statusPublished - 2007 Jul 1

Fingerprint

Light emitting diodes
light emitting diodes
ceramics
chips
finite volume method
Finite volume method
thermal resistance
Heat resistance
roughness
dissipation
Surface roughness
Hot Temperature
deviation
simulation
Temperature
temperature

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Materials Science(all)
  • Condensed Matter Physics

Cite this

Yang, Lianqiao ; Hu, Jianzheng ; Jang, Sunho ; Shin, Moo Whan. / Thermal design of ceramic packages for high power light-emitting diodes. In: Semiconductor Science and Technology. 2007 ; Vol. 22, No. 7. pp. 705-708.
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Thermal design of ceramic packages for high power light-emitting diodes. / Yang, Lianqiao; Hu, Jianzheng; Jang, Sunho; Shin, Moo Whan.

In: Semiconductor Science and Technology, Vol. 22, No. 7, 005, 01.07.2007, p. 705-708.

Research output: Contribution to journalArticle

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