Thermal design of high-power LED package and system

Research output: Chapter in Book/Report/Conference proceedingConference contribution

43 Citations (Scopus)

Abstract

In this paper we present thermal analysis of three kinds of ceramic package designs for high power LEDs and thermal characterization of high power LED array system. The analysis was made by transient thermal measurement and thermal simulation using the finite volume method (FVM). For the package design, thermal behaviors, as are described in thermal resistance, of the three packaging designs were compared and evaluated as functions of bulk thermal resistance, spreading resistance, and surface roughness. The deviation between the simulated results and measured data were attributed to the different surface roughness in the interfaces between the packaging components. For the system design, the emphasis is placed upon the investigation of junction temperature rise of LED array for a limited range of boundary conditions which include design effect of heat pipe, convection condition, and ambient temperature. It was found out that the measured junction temperatures and thermal resistance of LED array are increased with the input power and ambient temperature and decreased with the air velocity. An analytical thermal model analogous with an equivalent parallel circuit system was proposed and was verified by comparison with experimental data.

Original languageEnglish
Title of host publicationAdvanced LEDs for Solid State Lighting
Volume6355
DOIs
Publication statusPublished - 2006 Dec 27
EventAdvanced LEDs for Solid State Lighting - Gwangju, Korea, Republic of
Duration: 2006 Sep 52006 Sep 7

Other

OtherAdvanced LEDs for Solid State Lighting
CountryKorea, Republic of
CityGwangju
Period06/9/506/9/7

Fingerprint

Thermal Resistance
High Power
Light emitting diodes
light emitting diodes
thermal resistance
Heat resistance
Packaging
Surface Roughness
packaging
ambient temperature
surface roughness
Design Effect
thermal simulation
Thermal Model
Surface roughness
heat pipes
Thermal Analysis
finite volume method
Finite Volume Method
Temperature

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Shin, M. W. (2006). Thermal design of high-power LED package and system. In Advanced LEDs for Solid State Lighting (Vol. 6355). [635509] https://doi.org/10.1117/12.690928
Shin, Moo Whan. / Thermal design of high-power LED package and system. Advanced LEDs for Solid State Lighting. Vol. 6355 2006.
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Shin, MW 2006, Thermal design of high-power LED package and system. in Advanced LEDs for Solid State Lighting. vol. 6355, 635509, Advanced LEDs for Solid State Lighting, Gwangju, Korea, Republic of, 06/9/5. https://doi.org/10.1117/12.690928

Thermal design of high-power LED package and system. / Shin, Moo Whan.

Advanced LEDs for Solid State Lighting. Vol. 6355 2006. 635509.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Shin MW. Thermal design of high-power LED package and system. In Advanced LEDs for Solid State Lighting. Vol. 6355. 2006. 635509 https://doi.org/10.1117/12.690928