Thermal diffusion of heat pulse in subcooled liquid nitrogen

H. M. Chang, J. J. Byun, J. H. Choi, C. J. Ha, M. J. Kim, H. M. Kim, T. K. Ko

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Transient heat transfer caused by a heat pulse in subcooled liquid nitrogen is investigated experimentally. This study is part of our ongoing efforts to develop a stable cryogenic cooling system for superconducting fault current limiters (SFCL) in Korea. A thin heater attached by epoxy on one surface of a GFRP plate is immersed in a liquid-nitrogen bath at temperatures between 77 K and 65 K. A strong heat flux up to 150 W/cm2 is generated for 100 ms, and the temperature of the heater surface is measured as a function of time. The behavior of bubbles on the heating surface can be indirectly explained by comparing the measured temperature history for vertical and two different horizontal (up and down) orientations. It is concluded that subcooling liquid nitrogen below 70 K is a very effective method to suppress bubbles and result in better thermal protection and faster recovery from a heat pulse.

Original languageEnglish
Title of host publicationADVANCES IN CRYOGENIC ENGINEERING
Subtitle of host publicationTransactions of the Cryogenic Engineering Conference, CEC, Volume 51A
Pages488-495
Number of pages8
DOIs
Publication statusPublished - 2006 Apr 27
EventADVANCES IN CRYOGENIC ENGINEERING: Transactions of the Cryogenic Engineering Conference, CEC - Keystone, CO, United States
Duration: 2005 Aug 292005 Sep 2

Publication series

NameAIP Conference Proceedings
Volume823 I
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Other

OtherADVANCES IN CRYOGENIC ENGINEERING: Transactions of the Cryogenic Engineering Conference, CEC
CountryUnited States
CityKeystone, CO
Period05/8/2905/9/2

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy(all)

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    Chang, H. M., Byun, J. J., Choi, J. H., Ha, C. J., Kim, M. J., Kim, H. M., & Ko, T. K. (2006). Thermal diffusion of heat pulse in subcooled liquid nitrogen. In ADVANCES IN CRYOGENIC ENGINEERING: Transactions of the Cryogenic Engineering Conference, CEC, Volume 51A (pp. 488-495). (AIP Conference Proceedings; Vol. 823 I). https://doi.org/10.1063/1.2202452