Abstract
This work reports on the moisture inducing delamination in light-emitting diode (LED) packages and its effects on thermal characteristics. The LED samples were subjected to moisture preconditioning followed by heat block testing. Transient thermal measurements were performed to investigate the thermal behavior of the delaminated LEDs. Increase of thermal resistance with the degree of delamination was observed from the transient measurement. The thermo-mechanical calculated from coupled-field FEA simulation agree well with the micrographical evidence. The calculated hygro-mechanical stress increased with the preconditioning time. It was found that the thermo-mechanical stress plays more important role than the hygro-mechanical stress for the development of delamination in the LED packages. Moisture preconditioning for 3 hrs and 6 hrs under 85°C/85RH conditions was found to make little contribution to the delamination between the chip and lead frame.
| Original language | English |
|---|---|
| Title of host publication | Advanced LEDs for Solid State Lighting |
| Volume | 6355 |
| DOIs | |
| Publication status | Published - 2006 Dec 27 |
| Event | Advanced LEDs for Solid State Lighting - Gwangju, Korea, Republic of Duration: 2006 Sep 5 → 2006 Sep 7 |
Other
| Other | Advanced LEDs for Solid State Lighting |
|---|---|
| Country | Korea, Republic of |
| City | Gwangju |
| Period | 06/9/5 → 06/9/7 |
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All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering
Cite this
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Thermal effects of moisture inducing delamination in light-emitting diode packages. / Jianzheng, Hu; Lianqiao, Yang; Moo, Whan Shin.
Advanced LEDs for Solid State Lighting. Vol. 6355 2006. 635516.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Thermal effects of moisture inducing delamination in light-emitting diode packages
AU - Jianzheng, Hu
AU - Lianqiao, Yang
AU - Moo, Whan Shin
PY - 2006/12/27
Y1 - 2006/12/27
N2 - This work reports on the moisture inducing delamination in light-emitting diode (LED) packages and its effects on thermal characteristics. The LED samples were subjected to moisture preconditioning followed by heat block testing. Transient thermal measurements were performed to investigate the thermal behavior of the delaminated LEDs. Increase of thermal resistance with the degree of delamination was observed from the transient measurement. The thermo-mechanical calculated from coupled-field FEA simulation agree well with the micrographical evidence. The calculated hygro-mechanical stress increased with the preconditioning time. It was found that the thermo-mechanical stress plays more important role than the hygro-mechanical stress for the development of delamination in the LED packages. Moisture preconditioning for 3 hrs and 6 hrs under 85°C/85RH conditions was found to make little contribution to the delamination between the chip and lead frame.
AB - This work reports on the moisture inducing delamination in light-emitting diode (LED) packages and its effects on thermal characteristics. The LED samples were subjected to moisture preconditioning followed by heat block testing. Transient thermal measurements were performed to investigate the thermal behavior of the delaminated LEDs. Increase of thermal resistance with the degree of delamination was observed from the transient measurement. The thermo-mechanical calculated from coupled-field FEA simulation agree well with the micrographical evidence. The calculated hygro-mechanical stress increased with the preconditioning time. It was found that the thermo-mechanical stress plays more important role than the hygro-mechanical stress for the development of delamination in the LED packages. Moisture preconditioning for 3 hrs and 6 hrs under 85°C/85RH conditions was found to make little contribution to the delamination between the chip and lead frame.
UR - http://www.scopus.com/inward/record.url?scp=33845682985&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=33845682985&partnerID=8YFLogxK
U2 - 10.1117/12.691555
DO - 10.1117/12.691555
M3 - Conference contribution
AN - SCOPUS:33845682985
SN - 0819464503
SN - 9780819464507
VL - 6355
BT - Advanced LEDs for Solid State Lighting
ER -