Thermal effects of moisture inducing delamination in light-emitting diode packages

Hu Jianzheng, Yang Lianqiao, Whan Shin Moo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This work reports on the moisture inducing delamination in light-emitting diode (LED) packages and its effects on thermal characteristics. The LED samples were subjected to moisture preconditioning followed by heat block testing. Transient thermal measurements were performed to investigate the thermal behavior of the delaminated LEDs. Increase of thermal resistance with the degree of delamination was observed from the transient measurement. The thermo-mechanical calculated from coupled-field FEA simulation agree well with the micrographical evidence. The calculated hygro-mechanical stress increased with the preconditioning time. It was found that the thermo-mechanical stress plays more important role than the hygro-mechanical stress for the development of delamination in the LED packages. Moisture preconditioning for 3 hrs and 6 hrs under 85°C/85RH conditions was found to make little contribution to the delamination between the chip and lead frame.

Original languageEnglish
Title of host publicationAdvanced LEDs for Solid State Lighting
Volume6355
DOIs
Publication statusPublished - 2006 Dec 27
EventAdvanced LEDs for Solid State Lighting - Gwangju, Korea, Republic of
Duration: 2006 Sep 52006 Sep 7

Other

OtherAdvanced LEDs for Solid State Lighting
CountryKorea, Republic of
CityGwangju
Period06/9/506/9/7

Fingerprint

Delamination
Thermal Effects
Moisture
Diode
moisture
Thermal effects
Mechanical Stress
preconditioning
Light emitting diodes
temperature effects
light emitting diodes
Preconditioning
Thermal Resistance
thermal resistance
Heat resistance
Chip
Lead
Heat
chips
Finite element method

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Jianzheng, H., Lianqiao, Y., & Moo, W. S. (2006). Thermal effects of moisture inducing delamination in light-emitting diode packages. In Advanced LEDs for Solid State Lighting (Vol. 6355). [635516] https://doi.org/10.1117/12.691555
Jianzheng, Hu ; Lianqiao, Yang ; Moo, Whan Shin. / Thermal effects of moisture inducing delamination in light-emitting diode packages. Advanced LEDs for Solid State Lighting. Vol. 6355 2006.
@inproceedings{150a5803e7984f8eac1fd51993aca885,
title = "Thermal effects of moisture inducing delamination in light-emitting diode packages",
abstract = "This work reports on the moisture inducing delamination in light-emitting diode (LED) packages and its effects on thermal characteristics. The LED samples were subjected to moisture preconditioning followed by heat block testing. Transient thermal measurements were performed to investigate the thermal behavior of the delaminated LEDs. Increase of thermal resistance with the degree of delamination was observed from the transient measurement. The thermo-mechanical calculated from coupled-field FEA simulation agree well with the micrographical evidence. The calculated hygro-mechanical stress increased with the preconditioning time. It was found that the thermo-mechanical stress plays more important role than the hygro-mechanical stress for the development of delamination in the LED packages. Moisture preconditioning for 3 hrs and 6 hrs under 85°C/85RH conditions was found to make little contribution to the delamination between the chip and lead frame.",
author = "Hu Jianzheng and Yang Lianqiao and Moo, {Whan Shin}",
year = "2006",
month = "12",
day = "27",
doi = "10.1117/12.691555",
language = "English",
isbn = "0819464503",
volume = "6355",
booktitle = "Advanced LEDs for Solid State Lighting",

}

Jianzheng, H, Lianqiao, Y & Moo, WS 2006, Thermal effects of moisture inducing delamination in light-emitting diode packages. in Advanced LEDs for Solid State Lighting. vol. 6355, 635516, Advanced LEDs for Solid State Lighting, Gwangju, Korea, Republic of, 06/9/5. https://doi.org/10.1117/12.691555

Thermal effects of moisture inducing delamination in light-emitting diode packages. / Jianzheng, Hu; Lianqiao, Yang; Moo, Whan Shin.

Advanced LEDs for Solid State Lighting. Vol. 6355 2006. 635516.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Thermal effects of moisture inducing delamination in light-emitting diode packages

AU - Jianzheng, Hu

AU - Lianqiao, Yang

AU - Moo, Whan Shin

PY - 2006/12/27

Y1 - 2006/12/27

N2 - This work reports on the moisture inducing delamination in light-emitting diode (LED) packages and its effects on thermal characteristics. The LED samples were subjected to moisture preconditioning followed by heat block testing. Transient thermal measurements were performed to investigate the thermal behavior of the delaminated LEDs. Increase of thermal resistance with the degree of delamination was observed from the transient measurement. The thermo-mechanical calculated from coupled-field FEA simulation agree well with the micrographical evidence. The calculated hygro-mechanical stress increased with the preconditioning time. It was found that the thermo-mechanical stress plays more important role than the hygro-mechanical stress for the development of delamination in the LED packages. Moisture preconditioning for 3 hrs and 6 hrs under 85°C/85RH conditions was found to make little contribution to the delamination between the chip and lead frame.

AB - This work reports on the moisture inducing delamination in light-emitting diode (LED) packages and its effects on thermal characteristics. The LED samples were subjected to moisture preconditioning followed by heat block testing. Transient thermal measurements were performed to investigate the thermal behavior of the delaminated LEDs. Increase of thermal resistance with the degree of delamination was observed from the transient measurement. The thermo-mechanical calculated from coupled-field FEA simulation agree well with the micrographical evidence. The calculated hygro-mechanical stress increased with the preconditioning time. It was found that the thermo-mechanical stress plays more important role than the hygro-mechanical stress for the development of delamination in the LED packages. Moisture preconditioning for 3 hrs and 6 hrs under 85°C/85RH conditions was found to make little contribution to the delamination between the chip and lead frame.

UR - http://www.scopus.com/inward/record.url?scp=33845682985&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33845682985&partnerID=8YFLogxK

U2 - 10.1117/12.691555

DO - 10.1117/12.691555

M3 - Conference contribution

AN - SCOPUS:33845682985

SN - 0819464503

SN - 9780819464507

VL - 6355

BT - Advanced LEDs for Solid State Lighting

ER -

Jianzheng H, Lianqiao Y, Moo WS. Thermal effects of moisture inducing delamination in light-emitting diode packages. In Advanced LEDs for Solid State Lighting. Vol. 6355. 2006. 635516 https://doi.org/10.1117/12.691555