Thermal effects of moisture inducing delamination in light-emitting diode packages

Hu Jianzheng, Yang Lianqiao, Whan Shin Moo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

21 Citations (Scopus)

Abstract

This work reports on the moisture inducing delamination in light-emitting diode (LED) packages and its effects on thermal characteristics. The LED samples were subjected to moisture preconditioning followed by heat block testing. Transient thermal measurements were performed to investigate the thermal behavior of the delaminated LEDs. Increase of thermal resistance with the degree of delamination was observed from the transient measurement. The thermo-mechanical calculated from coupled-field FEA simulation agree well with the micrographical evidence. The calculated hygro-mechanical stress increased with the preconditioning time. It was found that the thermo-mechanical stress plays more important role than the hygro-mechanical stress for the development of delamination in the LED packages. Moisture preconditioning for 3 hrs and 6 hrs under 85°C/85RH conditions was found to make little contribution to the delamination between the chip and lead frame.

Original languageEnglish
Title of host publicationProceedings - IEEE 56th Electronic Components and Technology Conference
Pages1957-1962
Number of pages6
Volume2006
DOIs
Publication statusPublished - 2006 Dec 22
EventIEEE 56th Electronic Components and Technology Conference - San Diego, CA, United States
Duration: 2006 May 302006 Jun 2

Other

OtherIEEE 56th Electronic Components and Technology Conference
CountryUnited States
CitySan Diego, CA
Period06/5/3006/6/2

Fingerprint

Delamination
Thermal effects
Light emitting diodes
Moisture
Heat resistance
Lead
Finite element method
Hot Temperature
Testing

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Jianzheng, H., Lianqiao, Y., & Moo, W. S. (2006). Thermal effects of moisture inducing delamination in light-emitting diode packages. In Proceedings - IEEE 56th Electronic Components and Technology Conference (Vol. 2006, pp. 1957-1962). [1645928] https://doi.org/10.1109/ECTC.2006.1645928
Jianzheng, Hu ; Lianqiao, Yang ; Moo, Whan Shin. / Thermal effects of moisture inducing delamination in light-emitting diode packages. Proceedings - IEEE 56th Electronic Components and Technology Conference. Vol. 2006 2006. pp. 1957-1962
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Jianzheng, H, Lianqiao, Y & Moo, WS 2006, Thermal effects of moisture inducing delamination in light-emitting diode packages. in Proceedings - IEEE 56th Electronic Components and Technology Conference. vol. 2006, 1645928, pp. 1957-1962, IEEE 56th Electronic Components and Technology Conference, San Diego, CA, United States, 06/5/30. https://doi.org/10.1109/ECTC.2006.1645928

Thermal effects of moisture inducing delamination in light-emitting diode packages. / Jianzheng, Hu; Lianqiao, Yang; Moo, Whan Shin.

Proceedings - IEEE 56th Electronic Components and Technology Conference. Vol. 2006 2006. p. 1957-1962 1645928.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Jianzheng H, Lianqiao Y, Moo WS. Thermal effects of moisture inducing delamination in light-emitting diode packages. In Proceedings - IEEE 56th Electronic Components and Technology Conference. Vol. 2006. 2006. p. 1957-1962. 1645928 https://doi.org/10.1109/ECTC.2006.1645928