Abstract
Epoxy resin has excellent characteristics of moisture, low toughness, solvent and chemical resistance, low shrinkage on cure, superior electrical and mechanical resistance properties, and good adhesion to many substrates. In this experiment, we prepared epoxy resin with shape stabilized PCM, to enhance the thermal properties of epoxy resin. The SSPCM (shape stabilized PCM) was prepared through the vacuum impregnation method, and the SSPCM/epoxy resin composites were prepared through the shear stirring process and curing process. In the preparation process, the epoxy resin and hardener were mixed in a beaker at a one-to-one ratio. Then, 5wt%, 10wt%, 15wt% and 20wt% of the SSPCM was added to the mixture. The thermal properties of epoxy resin with SSPCM were analyzed from DSC, TGA and UTM analyzer. From the analysis, we determined that the prepared epoxy resin with SSPCM has heat storage capacity and high thermal conductivity, compared with the epoxy resin.
| Original language | English |
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| Title of host publication | Proceedings of the American Society for Composites - 30th Technical Conference, ACS 2015 |
| Editors | Xinran Xiao, Dahsin Liu, Alfred Loos |
| Publisher | DEStech Publications |
| ISBN (Electronic) | 9781605952253 |
| Publication status | Published - 2015 |
| Event | 30th Annual Technical Conference of the American Society for Composites, ASC 2015 - East Lansing, United States Duration: 2015 Sep 28 → 2015 Sep 30 |
Publication series
| Name | Proceedings of the American Society for Composites - 30th Technical Conference, ACS 2015 |
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Conference
| Conference | 30th Annual Technical Conference of the American Society for Composites, ASC 2015 |
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| Country/Territory | United States |
| City | East Lansing |
| Period | 15/9/28 → 15/9/30 |
Bibliographical note
Funding Information:This research was supported by a grant (14CTAP-C078014-01) from Infrastructure and Transportation Technology Promotion Research Program funded by Ministry of Land, Infrastructure and Transport of Korean government. This work was supported by the National Research Foundation of Korea (NRF) grant funded by the Korea government (MSIP) (No. 2014R1A2A1A11053829).
Publisher Copyright:
Copyright © 2015 by DEStech Publications, Inc. and American Society for Composites. All rights reserved.
All Science Journal Classification (ASJC) codes
- Ceramics and Composites