Thermal investigation of GaN-based laser diode package

Wong Joon Hwang, Tae Hee Lee, Jong Hwa Choi, Hyung Kun Kim, Ok Hyun Nam, Y. J. Park, Moo Whan Shin

Research output: Contribution to journalArticle

17 Citations (Scopus)

Abstract

We investigated thermal behavior of GaN-based laser diode (LD) packages as a function of cooling systems, die attaching materials, chip loading conditions, and optical performances. The electrical thermal transient technique was employed for the thermal measurement of junction temperature and thermal resistance of LD packages. The results demonstrate that the total thermal resistance of LD packages is controlled mainly by the packaging design rather than the chip structure itself. Significant changes in thermal resistance with input current were observed under a natural cooling system because of the sensitive change in the heat transfer coefficient with the change in temperature. Employment of PbSn as a die attachment was more advantageous over the Ag-paste in the thermal behavior of LD packages. The LD package with epi-down structure resulted in the lower thermal resistance compared to one with epi-up structure. A continuous increase in junction temperature was measured after lasing. It was attributed to an increase in the thermal resistance of LD when it took the optical power into an account. Effective input power was decreased by the lasing and led to high thermal resistance values.

Original languageEnglish
Pages (from-to)637-642
Number of pages6
JournalIEEE Transactions on Components and Packaging Technologies
Volume30
Issue number4
DOIs
Publication statusPublished - 2007 Dec 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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