Thermal investigation of LED lighting module

Jong Hwa Choi, Moo Whan Shin

Research output: Contribution to journalArticle

51 Citations (Scopus)

Abstract

This paper reports on the thermal analysis and improvement of the light emitting diode (LED) module as a lighting source. The analysis was made by transient thermal measurement and thermal simulation using the Finite Volume Method. Two basic thermal schemes were applied for the decrease of the junction temperature of the LED module. Thermal resistance was analytically defined for the LED module with multi LED packages and was confirmed by the experimental data obtained from the thermal transient method. It was found that the thermal improvement of the LED module led to the enhancement of the light output power and radiant intensity. The thermally designed LED module exhibited about 20% decrease in junction temperature compared with a basic structure before thermal design. The temperature calibrating factor, 0.046 nm/°C, was calculated from the peak wavelengths of the LED modules.

Original languageEnglish
Pages (from-to)830-835
Number of pages6
JournalMicroelectronics Reliability
Volume52
Issue number5
DOIs
Publication statusPublished - 2012 May 1

Fingerprint

illuminating
Light emitting diodes
light emitting diodes
modules
Lighting
thermal simulation
finite volume method
Finite volume method
thermal resistance
calibrating
Hot Temperature
Heat resistance
Temperature
Thermoanalysis
temperature
radiant flux density
thermal analysis
Wavelength
augmentation
output

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality

Cite this

Choi, Jong Hwa ; Shin, Moo Whan. / Thermal investigation of LED lighting module. In: Microelectronics Reliability. 2012 ; Vol. 52, No. 5. pp. 830-835.
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Thermal investigation of LED lighting module. / Choi, Jong Hwa; Shin, Moo Whan.

In: Microelectronics Reliability, Vol. 52, No. 5, 01.05.2012, p. 830-835.

Research output: Contribution to journalArticle

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