Abstract
This paper reports on the thermal analysis and improvement of the light emitting diode (LED) module as a lighting source. The analysis was made by transient thermal measurement and thermal simulation using the Finite Volume Method. Two basic thermal schemes were applied for the decrease of the junction temperature of the LED module. Thermal resistance was analytically defined for the LED module with multi LED packages and was confirmed by the experimental data obtained from the thermal transient method. It was found that the thermal improvement of the LED module led to the enhancement of the light output power and radiant intensity. The thermally designed LED module exhibited about 20% decrease in junction temperature compared with a basic structure before thermal design. The temperature calibrating factor, 0.046 nm/°C, was calculated from the peak wavelengths of the LED modules.
| Original language | English |
|---|---|
| Pages (from-to) | 830-835 |
| Number of pages | 6 |
| Journal | Microelectronics Reliability |
| Volume | 52 |
| Issue number | 5 |
| DOIs | |
| Publication status | Published - 2012 May 1 |
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All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
- Surfaces, Coatings and Films
- Atomic and Molecular Physics, and Optics
- Condensed Matter Physics
- Safety, Risk, Reliability and Quality
Cite this
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Thermal investigation of LED lighting module. / Choi, Jong Hwa; Shin, Moo Whan.
In: Microelectronics Reliability, Vol. 52, No. 5, 01.05.2012, p. 830-835.Research output: Contribution to journal › Article
TY - JOUR
T1 - Thermal investigation of LED lighting module
AU - Choi, Jong Hwa
AU - Shin, Moo Whan
PY - 2012/5/1
Y1 - 2012/5/1
N2 - This paper reports on the thermal analysis and improvement of the light emitting diode (LED) module as a lighting source. The analysis was made by transient thermal measurement and thermal simulation using the Finite Volume Method. Two basic thermal schemes were applied for the decrease of the junction temperature of the LED module. Thermal resistance was analytically defined for the LED module with multi LED packages and was confirmed by the experimental data obtained from the thermal transient method. It was found that the thermal improvement of the LED module led to the enhancement of the light output power and radiant intensity. The thermally designed LED module exhibited about 20% decrease in junction temperature compared with a basic structure before thermal design. The temperature calibrating factor, 0.046 nm/°C, was calculated from the peak wavelengths of the LED modules.
AB - This paper reports on the thermal analysis and improvement of the light emitting diode (LED) module as a lighting source. The analysis was made by transient thermal measurement and thermal simulation using the Finite Volume Method. Two basic thermal schemes were applied for the decrease of the junction temperature of the LED module. Thermal resistance was analytically defined for the LED module with multi LED packages and was confirmed by the experimental data obtained from the thermal transient method. It was found that the thermal improvement of the LED module led to the enhancement of the light output power and radiant intensity. The thermally designed LED module exhibited about 20% decrease in junction temperature compared with a basic structure before thermal design. The temperature calibrating factor, 0.046 nm/°C, was calculated from the peak wavelengths of the LED modules.
UR - http://www.scopus.com/inward/record.url?scp=84860362564&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84860362564&partnerID=8YFLogxK
U2 - 10.1016/j.microrel.2011.04.009
DO - 10.1016/j.microrel.2011.04.009
M3 - Article
AN - SCOPUS:84860362564
VL - 52
SP - 830
EP - 835
JO - Microelectronics Reliability
JF - Microelectronics Reliability
SN - 0026-2714
IS - 5
ER -