Abstract
This paper reports on the thermal analysis and improvement of the light emitting diode (LED) module as a lighting source. The analysis was made by transient thermal measurement and thermal simulation using the Finite Volume Method. Two basic thermal schemes were applied for the decrease of the junction temperature of the LED module. Thermal resistance was analytically defined for the LED module with multi LED packages and was confirmed by the experimental data obtained from the thermal transient method. It was found that the thermal improvement of the LED module led to the enhancement of the light output power and radiant intensity. The thermally designed LED module exhibited about 20% decrease in junction temperature compared with a basic structure before thermal design. The temperature calibrating factor, 0.046 nm/°C, was calculated from the peak wavelengths of the LED modules.
| Original language | English |
|---|---|
| Pages (from-to) | 830-835 |
| Number of pages | 6 |
| Journal | Microelectronics Reliability |
| Volume | 52 |
| Issue number | 5 |
| DOIs | |
| Publication status | Published - 2012 May |
Bibliographical note
Funding Information:This research was supported by Technology Development Program for Agriculture and Forestry, Ministry for Food, Agriculture, Forestry and Fisheries, Republic of Korea.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- Condensed Matter Physics
- Safety, Risk, Reliability and Quality
- Surfaces, Coatings and Films
- Electrical and Electronic Engineering