Thermal modeling of 7 nm node bulk fin-shaped field-effect transistors for device structure-aware design

Engineering & Materials Science

• Field effect transistors 89%
• Computer simulation 45%
• Heating 44%
• Hot Temperature 40%
• Computer aided design 34%
• Silica 21%
• Heat resistance 21%
• Integrated circuits 19%
• Thermal conductivity 18%
• Semiconductor materials 18%
• Thermodynamics 17%
• Silicon 16%

Physics & Astronomy

• fins 100%
• field effect transistors 65%
• heating 31%
• simulation 19%
• thermal resistance 18%
• integrated circuits 15%
• thermal conductivity 13%
• silicon dioxide 12%
• scaling 11%
• thermodynamics 11%
• silicon 8%

Chemistry

• Field Effect 82%
• Simulation 52%
• Silicon Dioxide 34%
• Thermal Resistance 33%
• Thermal Conductivity 26%
• Semiconductor 21%
• Dimension 20%
• Thermodynamics 17%