A package-level reliability test using a solder ball of a Sn-Ag-Cu-Ge alloy, was investigated. After using a lead-free solder in the manufacturing process, the discoloring problem arises after many times in the reflow process. The surface oxidation of the lead-free solders were investigated using X-ray photoelectron spectroscopy (XPS). The results show that Sn-Ag-Cu-Ge alloy is a good candidate to solve the oxidation problem and it is important to know the thermal oxidation mechanism and characteristics of the Pb-free solders.
All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Condensed Matter Physics