Thermal performance analysis according to wood flooring structure for energy conservation in radiant floor heating systems

Jungki Seo, Jisoo Jeon, Jeong Hun Lee, Sumin Kim

Research output: Contribution to journalArticle

29 Citations (Scopus)

Abstract

The aim of this study was to reduce energy consumption, especially heating, in buildings. Improvements in the thermal conductivity of wood flooring, which was considered to decrease heating between floors and the indoor areas, were investigated. Wood flooring components such as solid-wood, high-density fiberboard (HDF), adhesives and polyethylene generally exhibit low thermal conductivity. The thermal conductivity and transfer performance of 21 replicates of wood flooring materials generally used in Korea were measured. The thermal conductivity was measured by using the guarded hot plate method. The thermal conductivities differed according to the structure of the floorings. Laminate wood flooring exhibited the highest thermal conductivity because of its high density and thin layers compared to the other floorings. The thermal transfer performance differed according to the installation method. The floating installation method exhibited a lower thermal transfer speed than the adhesion installation method because of its air layers and polyethylene form.

Original languageEnglish
Pages (from-to)2039-2042
Number of pages4
JournalEnergy and Buildings
Volume43
Issue number8
DOIs
Publication statusPublished - 2011 Aug 1

Fingerprint

Thermal conductivity
Wood
Energy conservation
Heating
Wood laminates
Polyethylenes
Hot Temperature
Adhesives
Adhesion
Energy utilization
Air

All Science Journal Classification (ASJC) codes

  • Civil and Structural Engineering
  • Building and Construction
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

@article{29f5d2111943407a9368a17e95a349ff,
title = "Thermal performance analysis according to wood flooring structure for energy conservation in radiant floor heating systems",
abstract = "The aim of this study was to reduce energy consumption, especially heating, in buildings. Improvements in the thermal conductivity of wood flooring, which was considered to decrease heating between floors and the indoor areas, were investigated. Wood flooring components such as solid-wood, high-density fiberboard (HDF), adhesives and polyethylene generally exhibit low thermal conductivity. The thermal conductivity and transfer performance of 21 replicates of wood flooring materials generally used in Korea were measured. The thermal conductivity was measured by using the guarded hot plate method. The thermal conductivities differed according to the structure of the floorings. Laminate wood flooring exhibited the highest thermal conductivity because of its high density and thin layers compared to the other floorings. The thermal transfer performance differed according to the installation method. The floating installation method exhibited a lower thermal transfer speed than the adhesion installation method because of its air layers and polyethylene form.",
author = "Jungki Seo and Jisoo Jeon and Lee, {Jeong Hun} and Sumin Kim",
year = "2011",
month = "8",
day = "1",
doi = "10.1016/j.enbuild.2011.04.019",
language = "English",
volume = "43",
pages = "2039--2042",
journal = "Energy and Buildings",
issn = "0378-7788",
publisher = "Elsevier BV",
number = "8",

}

Thermal performance analysis according to wood flooring structure for energy conservation in radiant floor heating systems. / Seo, Jungki; Jeon, Jisoo; Lee, Jeong Hun; Kim, Sumin.

In: Energy and Buildings, Vol. 43, No. 8, 01.08.2011, p. 2039-2042.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Thermal performance analysis according to wood flooring structure for energy conservation in radiant floor heating systems

AU - Seo, Jungki

AU - Jeon, Jisoo

AU - Lee, Jeong Hun

AU - Kim, Sumin

PY - 2011/8/1

Y1 - 2011/8/1

N2 - The aim of this study was to reduce energy consumption, especially heating, in buildings. Improvements in the thermal conductivity of wood flooring, which was considered to decrease heating between floors and the indoor areas, were investigated. Wood flooring components such as solid-wood, high-density fiberboard (HDF), adhesives and polyethylene generally exhibit low thermal conductivity. The thermal conductivity and transfer performance of 21 replicates of wood flooring materials generally used in Korea were measured. The thermal conductivity was measured by using the guarded hot plate method. The thermal conductivities differed according to the structure of the floorings. Laminate wood flooring exhibited the highest thermal conductivity because of its high density and thin layers compared to the other floorings. The thermal transfer performance differed according to the installation method. The floating installation method exhibited a lower thermal transfer speed than the adhesion installation method because of its air layers and polyethylene form.

AB - The aim of this study was to reduce energy consumption, especially heating, in buildings. Improvements in the thermal conductivity of wood flooring, which was considered to decrease heating between floors and the indoor areas, were investigated. Wood flooring components such as solid-wood, high-density fiberboard (HDF), adhesives and polyethylene generally exhibit low thermal conductivity. The thermal conductivity and transfer performance of 21 replicates of wood flooring materials generally used in Korea were measured. The thermal conductivity was measured by using the guarded hot plate method. The thermal conductivities differed according to the structure of the floorings. Laminate wood flooring exhibited the highest thermal conductivity because of its high density and thin layers compared to the other floorings. The thermal transfer performance differed according to the installation method. The floating installation method exhibited a lower thermal transfer speed than the adhesion installation method because of its air layers and polyethylene form.

UR - http://www.scopus.com/inward/record.url?scp=79957835110&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=79957835110&partnerID=8YFLogxK

U2 - 10.1016/j.enbuild.2011.04.019

DO - 10.1016/j.enbuild.2011.04.019

M3 - Article

VL - 43

SP - 2039

EP - 2042

JO - Energy and Buildings

JF - Energy and Buildings

SN - 0378-7788

IS - 8

ER -