Abstract
Among the PCMs, Bio-based PCMs are considered one of the most promising candidates, due to their large latent heat, low vapor pressure in the melt, good chemical stability, self-nucleating behavior, safety, and commercial availability at low cost. However, the leakage problem and low thermal conductivity of Bio-based PCM limit its application, to some extent. Therefore, porous materials with a high thermal conductivity, such as boron nitride, are promising candidates for simultaneously solving these two problems. In this study, we prepared Bio-based PCM with boron nitride, by using the vacuum impregnation process. We analyzed the microstructure, chemical bonding, heat capacity, thermal resistance and Thermal conductivity of Bio-based PCM with boron nitride, by SEM, FTIR, DSC, TGA and TCi analyses. From the analyses, we expect Bio-based PCM with boron nitride to be useful in applications in various fields, due to its high thermal properties.
| Original language | English |
|---|---|
| Pages (from-to) | 245-250 |
| Number of pages | 6 |
| Journal | International Journal of Heat and Mass Transfer |
| Volume | 71 |
| DOIs | |
| Publication status | Published - 2014 Apr 1 |
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All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Mechanical Engineering
- Fluid Flow and Transfer Processes
Cite this
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Thermal performance evaluation of Bio-based shape stabilized PCM with boron nitride for energy saving. / Jeong, Su Gwang; Lee, Jeong Hun; Seo, Jungki; Kim, Sumin.
In: International Journal of Heat and Mass Transfer, Vol. 71, 01.04.2014, p. 245-250.Research output: Contribution to journal › Article
TY - JOUR
T1 - Thermal performance evaluation of Bio-based shape stabilized PCM with boron nitride for energy saving
AU - Jeong, Su Gwang
AU - Lee, Jeong Hun
AU - Seo, Jungki
AU - Kim, Sumin
PY - 2014/4/1
Y1 - 2014/4/1
N2 - Among the PCMs, Bio-based PCMs are considered one of the most promising candidates, due to their large latent heat, low vapor pressure in the melt, good chemical stability, self-nucleating behavior, safety, and commercial availability at low cost. However, the leakage problem and low thermal conductivity of Bio-based PCM limit its application, to some extent. Therefore, porous materials with a high thermal conductivity, such as boron nitride, are promising candidates for simultaneously solving these two problems. In this study, we prepared Bio-based PCM with boron nitride, by using the vacuum impregnation process. We analyzed the microstructure, chemical bonding, heat capacity, thermal resistance and Thermal conductivity of Bio-based PCM with boron nitride, by SEM, FTIR, DSC, TGA and TCi analyses. From the analyses, we expect Bio-based PCM with boron nitride to be useful in applications in various fields, due to its high thermal properties.
AB - Among the PCMs, Bio-based PCMs are considered one of the most promising candidates, due to their large latent heat, low vapor pressure in the melt, good chemical stability, self-nucleating behavior, safety, and commercial availability at low cost. However, the leakage problem and low thermal conductivity of Bio-based PCM limit its application, to some extent. Therefore, porous materials with a high thermal conductivity, such as boron nitride, are promising candidates for simultaneously solving these two problems. In this study, we prepared Bio-based PCM with boron nitride, by using the vacuum impregnation process. We analyzed the microstructure, chemical bonding, heat capacity, thermal resistance and Thermal conductivity of Bio-based PCM with boron nitride, by SEM, FTIR, DSC, TGA and TCi analyses. From the analyses, we expect Bio-based PCM with boron nitride to be useful in applications in various fields, due to its high thermal properties.
UR - http://www.scopus.com/inward/record.url?scp=84891886789&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84891886789&partnerID=8YFLogxK
U2 - 10.1016/j.ijheatmasstransfer.2013.12.017
DO - 10.1016/j.ijheatmasstransfer.2013.12.017
M3 - Article
VL - 71
SP - 245
EP - 250
JO - International Journal of Heat and Mass Transfer
JF - International Journal of Heat and Mass Transfer
SN - 0017-9310
ER -