Thermal performance of wooden building envelope by thermal conductivity of structural members

Sumin Kim, Sughwan Kim, Seulgi Yu, Jungki Seo

Research output: Contribution to journalArticle

11 Citations (Scopus)

Abstract

Building energy simulations which are mainly used in Korea have evaluated the building energy performance with the different thermal conductivity of construction materials. In order to evaluate the energy consumption accurately, the difference in thermal conductivity of the wood used in stud for wooden structure was confirmed from the each simulation. In addition, the thermal transmission of building members and the thermal bridge at the conjunction of building members according to thermal conductivity from each simulation programs were researched. The thermal conductivity of pine that has the largest variation among the energy simulations was applied to the thermal properties of studs in wooden structure. The maximum error between the maximum and minimum thermal transmission of roof, wall, and floor slab was 0.023 W/m 2·K. Plus, that thermal bridge at Rafter junction on the roof, roof-wall joint, and floor slab-wall joint was 0.025 W/m·K. The heat transfer image for changes in temperature and the heat exchange were analyzed by HEAT2 program. The distorted temperature lines were found around the insufficient insulated connection parts. It was predicted that the temperature at the distorted parts in the analyzed image was lower than that of the other portion of the other structures.

Original languageEnglish
Pages (from-to)515-527
Number of pages13
JournalJournal of the Korean Wood Science and Technology
Volume41
Issue number6
DOIs
Publication statusPublished - 2013 Dec 1

All Science Journal Classification (ASJC) codes

  • Materials Science (miscellaneous)
  • Industrial and Manufacturing Engineering

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