Thermal properties and water sorption behaviors of epoxy and bismaleimide composites

Jongchul Seo, Wonbong Jang, Haksoo Han

Research output: Contribution to journalArticle

28 Citations (Scopus)

Abstract

In this work, we prepared epoxy/BMI composites by using N,N′-bismaleimide-4,4′-diphenylmethane (BMI), epoxy resin (diglycidyl ether of bisphenol-A (DGEBA)), and 4,4′-diamino diphenyl methane (DDM). The thermal properties and water sorption behaviors of the epoxy and BMI composites were investigated. For the epoxy/BMI composites, the glass transition and decomposition temperatures both increased with increasing BMI addition, which indicates the effect of BMI addition on improved thermal stability. The water sorption behaviors were gravimetrically measured as a function of humidity, temperature, and composition. The diffusion coefficient and water uptake decreased and the activation energy for water diffusion increased with increasing BMI content, indicating that the water sorption in epoxy resin, which causes reliability problems in electronic devices, can be diminished by BMI addition. The water sorption behaviors in the epoxy/BMI composites were interpreted in terms of their chemical and morphological structures.

Original languageEnglish
Pages (from-to)10-16
Number of pages7
JournalMacromolecular Research
Volume15
Issue number1
DOIs
Publication statusPublished - 2007 Jan 1

Fingerprint

Sorption
Thermodynamic properties
Water
Composite materials
Epoxy Resins
Epoxy resins
Methane
Glass transition
Ethers
Atmospheric humidity
Thermodynamic stability
Activation energy
Decomposition
Temperature
Chemical analysis

All Science Journal Classification (ASJC) codes

  • Chemical Engineering(all)
  • Organic Chemistry
  • Polymers and Plastics
  • Materials Chemistry

Cite this

@article{acd38f9dcedd40a4ab83b7671d76e6f6,
title = "Thermal properties and water sorption behaviors of epoxy and bismaleimide composites",
abstract = "In this work, we prepared epoxy/BMI composites by using N,N′-bismaleimide-4,4′-diphenylmethane (BMI), epoxy resin (diglycidyl ether of bisphenol-A (DGEBA)), and 4,4′-diamino diphenyl methane (DDM). The thermal properties and water sorption behaviors of the epoxy and BMI composites were investigated. For the epoxy/BMI composites, the glass transition and decomposition temperatures both increased with increasing BMI addition, which indicates the effect of BMI addition on improved thermal stability. The water sorption behaviors were gravimetrically measured as a function of humidity, temperature, and composition. The diffusion coefficient and water uptake decreased and the activation energy for water diffusion increased with increasing BMI content, indicating that the water sorption in epoxy resin, which causes reliability problems in electronic devices, can be diminished by BMI addition. The water sorption behaviors in the epoxy/BMI composites were interpreted in terms of their chemical and morphological structures.",
author = "Jongchul Seo and Wonbong Jang and Haksoo Han",
year = "2007",
month = "1",
day = "1",
doi = "10.1007/BF03218746",
language = "English",
volume = "15",
pages = "10--16",
journal = "Macromolecular Research",
issn = "1598-5032",
publisher = "Polymer Society of Korea",
number = "1",

}

Thermal properties and water sorption behaviors of epoxy and bismaleimide composites. / Seo, Jongchul; Jang, Wonbong; Han, Haksoo.

In: Macromolecular Research, Vol. 15, No. 1, 01.01.2007, p. 10-16.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Thermal properties and water sorption behaviors of epoxy and bismaleimide composites

AU - Seo, Jongchul

AU - Jang, Wonbong

AU - Han, Haksoo

PY - 2007/1/1

Y1 - 2007/1/1

N2 - In this work, we prepared epoxy/BMI composites by using N,N′-bismaleimide-4,4′-diphenylmethane (BMI), epoxy resin (diglycidyl ether of bisphenol-A (DGEBA)), and 4,4′-diamino diphenyl methane (DDM). The thermal properties and water sorption behaviors of the epoxy and BMI composites were investigated. For the epoxy/BMI composites, the glass transition and decomposition temperatures both increased with increasing BMI addition, which indicates the effect of BMI addition on improved thermal stability. The water sorption behaviors were gravimetrically measured as a function of humidity, temperature, and composition. The diffusion coefficient and water uptake decreased and the activation energy for water diffusion increased with increasing BMI content, indicating that the water sorption in epoxy resin, which causes reliability problems in electronic devices, can be diminished by BMI addition. The water sorption behaviors in the epoxy/BMI composites were interpreted in terms of their chemical and morphological structures.

AB - In this work, we prepared epoxy/BMI composites by using N,N′-bismaleimide-4,4′-diphenylmethane (BMI), epoxy resin (diglycidyl ether of bisphenol-A (DGEBA)), and 4,4′-diamino diphenyl methane (DDM). The thermal properties and water sorption behaviors of the epoxy and BMI composites were investigated. For the epoxy/BMI composites, the glass transition and decomposition temperatures both increased with increasing BMI addition, which indicates the effect of BMI addition on improved thermal stability. The water sorption behaviors were gravimetrically measured as a function of humidity, temperature, and composition. The diffusion coefficient and water uptake decreased and the activation energy for water diffusion increased with increasing BMI content, indicating that the water sorption in epoxy resin, which causes reliability problems in electronic devices, can be diminished by BMI addition. The water sorption behaviors in the epoxy/BMI composites were interpreted in terms of their chemical and morphological structures.

UR - http://www.scopus.com/inward/record.url?scp=33847717061&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33847717061&partnerID=8YFLogxK

U2 - 10.1007/BF03218746

DO - 10.1007/BF03218746

M3 - Article

AN - SCOPUS:33847717061

VL - 15

SP - 10

EP - 16

JO - Macromolecular Research

JF - Macromolecular Research

SN - 1598-5032

IS - 1

ER -