Thermal resistance analysis of high power LEDs with multi-chip package

Lan Kim, Woong Joon Hwang, Moo Whan Shin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

19 Citations (Scopus)

Abstract

Thermal transient measurements of high power GaN-based LEDs with multi-chip designs are presented and discussed. Once transient cooling curve was obtained, the structure function theory was applied to determine the thermal resistance of packages. The measured total thermal resistances from junction to ambient were 19.87 K/W, 10.78 K/W, 6.77 K/W for the one-chip, two-chip and four-chip package, respectively. The contribution of each component to the total thermal resistance of the package can be calculated from the cumulative structure function and differential structure function. The total thermal resistance of multi-chip package is found to decrease with the number of chips due to parallel heat dissipation. Very useful thermal design rule for high power multi-chip LED package is analogized from the experiments. It was found that the effect of the number of chips in a package on the thermal resistance depends on the ratio of partial thermal resistance of chip and that of slug. Thermal resistance for full color multi chip LEDs, where each chip is driven independently, was measured as well and the implication was discussed.

Original languageEnglish
Title of host publicationProceedings - IEEE 56th Electronic Components and Technology Conference
Pages1076-1081
Number of pages6
Volume2006
DOIs
Publication statusPublished - 2006 Dec 22
EventIEEE 56th Electronic Components and Technology Conference - San Diego, CA, United States
Duration: 2006 May 302006 Jun 2

Other

OtherIEEE 56th Electronic Components and Technology Conference
CountryUnited States
CitySan Diego, CA
Period06/5/3006/6/2

Fingerprint

Heat resistance
Light emitting diodes
Heat losses
Cooling
Color
Experiments

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Kim, L., Hwang, W. J., & Shin, M. W. (2006). Thermal resistance analysis of high power LEDs with multi-chip package. In Proceedings - IEEE 56th Electronic Components and Technology Conference (Vol. 2006, pp. 1076-1081). [1645787] https://doi.org/10.1109/ECTC.2006.1645787
Kim, Lan ; Hwang, Woong Joon ; Shin, Moo Whan. / Thermal resistance analysis of high power LEDs with multi-chip package. Proceedings - IEEE 56th Electronic Components and Technology Conference. Vol. 2006 2006. pp. 1076-1081
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Kim, L, Hwang, WJ & Shin, MW 2006, Thermal resistance analysis of high power LEDs with multi-chip package. in Proceedings - IEEE 56th Electronic Components and Technology Conference. vol. 2006, 1645787, pp. 1076-1081, IEEE 56th Electronic Components and Technology Conference, San Diego, CA, United States, 06/5/30. https://doi.org/10.1109/ECTC.2006.1645787

Thermal resistance analysis of high power LEDs with multi-chip package. / Kim, Lan; Hwang, Woong Joon; Shin, Moo Whan.

Proceedings - IEEE 56th Electronic Components and Technology Conference. Vol. 2006 2006. p. 1076-1081 1645787.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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AB - Thermal transient measurements of high power GaN-based LEDs with multi-chip designs are presented and discussed. Once transient cooling curve was obtained, the structure function theory was applied to determine the thermal resistance of packages. The measured total thermal resistances from junction to ambient were 19.87 K/W, 10.78 K/W, 6.77 K/W for the one-chip, two-chip and four-chip package, respectively. The contribution of each component to the total thermal resistance of the package can be calculated from the cumulative structure function and differential structure function. The total thermal resistance of multi-chip package is found to decrease with the number of chips due to parallel heat dissipation. Very useful thermal design rule for high power multi-chip LED package is analogized from the experiments. It was found that the effect of the number of chips in a package on the thermal resistance depends on the ratio of partial thermal resistance of chip and that of slug. Thermal resistance for full color multi chip LEDs, where each chip is driven independently, was measured as well and the implication was discussed.

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Kim L, Hwang WJ, Shin MW. Thermal resistance analysis of high power LEDs with multi-chip package. In Proceedings - IEEE 56th Electronic Components and Technology Conference. Vol. 2006. 2006. p. 1076-1081. 1645787 https://doi.org/10.1109/ECTC.2006.1645787