Thermal resistance measurement of LEDs with multi-chip packages

Lan Kim, Moo Whan Shin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Abstract

Thermal transient measurements of high power GaN-based LEDs with multi-chip designs are presented and discussed in the paper. Once transient cooling curve was obtained, the structure function theory was applied to determine the thermal resistance of packages. The total thermal resistance from junction to ambient considering optical power is 19.87 K/W, 10.78 K/W, 6.77 K/W for the one-chip, two-chip and four-chip packages, respectively. The contribution of each component to the total thermal resistance of the package can be determined from the cumulative structure function and differential structure function. The total thermal resistance of multi-chip packages is found to decrease with the number of chips due to parallel heat dissipation. Moreover, an important thermal design rule for high power multi-chip LEDs is analogized from the experiments. With the number of chips increasing, the thermal resistance can be decreased, but the impact will be different with the ratio of partial thermal resistance.

Original languageEnglish
Title of host publicationTwenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium, SEMI-THERM 2006
Pages186-190
Number of pages5
Publication statusPublished - 2006
Event22nd Annual IEEE Semiconductor Thermal Measurement and Management, SEMI-THERM 2006 - Dallas, TX, United States
Duration: 2006 Mar 142006 Mar 16

Publication series

NameAnnual IEEE Semiconductor Thermal Measurement and Management Symposium
Volume2006
ISSN (Print)1065-2221

Other

Other22nd Annual IEEE Semiconductor Thermal Measurement and Management, SEMI-THERM 2006
CountryUnited States
CityDallas, TX
Period06/3/1406/3/16

All Science Journal Classification (ASJC) codes

  • Instrumentation
  • Electrical and Electronic Engineering

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  • Cite this

    Kim, L., & Shin, M. W. (2006). Thermal resistance measurement of LEDs with multi-chip packages. In Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium, SEMI-THERM 2006 (pp. 186-190). [1625226] (Annual IEEE Semiconductor Thermal Measurement and Management Symposium; Vol. 2006).